FABRICATION OF A SACRIFICIAL INTERPOSER TEST STRUCTURE
First Claim
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1. An interposer test structure attached to a device, comprising:
- a bonding pad affixed to each of two or more interposer via contacts and each of two or more interposer lead contacts, wherein the two or more interposer via contacts and two or more interposer lead contacts are embedded in an insulator material layer;
a separate interposer via in physical and electrical contact with each pair of the two or more interposer via contacts;
a separate lead in physical and electrical contact with each pair of the two or more interposer lead contacts;
two or more chip contacts, wherein one of the two or more chip contacts is in physical and electrical contact with a first of the interposer vias and another of the two or more chip contacts is in physical and electrical contact with a second of the interposer vias; and
an interposer lead embedded in the insulator material layer, and in physical and electrical contact with the two separate leads.
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Abstract
A sacrificial interposer test structure including a release layer, a dummy layer on the release layer, one or more conductive pads embedded in the dummy layer, wherein each of the one or more conductive pads has an exposed surface, and a tie layer on the dummy layer and on each exposed surface of the one or more conductive pads.
5 Citations
20 Claims
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1. An interposer test structure attached to a device, comprising:
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a bonding pad affixed to each of two or more interposer via contacts and each of two or more interposer lead contacts, wherein the two or more interposer via contacts and two or more interposer lead contacts are embedded in an insulator material layer; a separate interposer via in physical and electrical contact with each pair of the two or more interposer via contacts; a separate lead in physical and electrical contact with each pair of the two or more interposer lead contacts; two or more chip contacts, wherein one of the two or more chip contacts is in physical and electrical contact with a first of the interposer vias and another of the two or more chip contacts is in physical and electrical contact with a second of the interposer vias; and an interposer lead embedded in the insulator material layer, and in physical and electrical contact with the two separate leads. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method of using an interposer test structure, comprising:
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forming a plurality of conductive pads on a substrate; depositing a tie layer on at least two of the plurality of conductive pads, wherein the tie layer is in electrical contact with the at least two of the plurality of conductive pads; forming four interposer contacts in an insulator layer, wherein each of the four interposer contacts is in physical and electrical contact with the tie layer; forming an interposer lead electrically connecting two of the four interposer contacts; forming a separate chip contact to each of two of the four interposer contacts other than the two interposer contacts electrically connected by the interposer lead, wherein the two chip contacts, four interposer contacts, tie layer, and interposer lead form an electrical path; and measuring the resistance across the electrical path. - View Dependent Claims (10, 11, 12, 13, 14)
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15. A method of testing an interposer, comprising:
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forming an interposer on a sacrificial test structure, wherein the interposer includes a body and a plurality of electrically connected interposer contacts and chip contacts embedded in the body, where at least a portion of the electrically connected interposer contacts are in electrical contact with the sacrificial test structure; and attaching at least two test probes to at least two different chip contacts on the surface of the interposer, wherein a resistance between the electrically connected interposer contacts is measured to determine if a conductive path between the electrically connected interposer contacts is open or closed. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification