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FABRICATION OF A SACRIFICIAL INTERPOSER TEST STRUCTURE

  • US 20190006250A1
  • Filed: 08/17/2018
  • Published: 01/03/2019
  • Est. Priority Date: 06/08/2016
  • Status: Active Grant
First Claim
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1. An interposer test structure attached to a device, comprising:

  • a bonding pad affixed to each of two or more interposer via contacts and each of two or more interposer lead contacts, wherein the two or more interposer via contacts and two or more interposer lead contacts are embedded in an insulator material layer;

    a separate interposer via in physical and electrical contact with each pair of the two or more interposer via contacts;

    a separate lead in physical and electrical contact with each pair of the two or more interposer lead contacts;

    two or more chip contacts, wherein one of the two or more chip contacts is in physical and electrical contact with a first of the interposer vias and another of the two or more chip contacts is in physical and electrical contact with a second of the interposer vias; and

    an interposer lead embedded in the insulator material layer, and in physical and electrical contact with the two separate leads.

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