SOLID-STATE IMAGE SENSING DEVICE, MANUFACTURING METHOD, AND ELECTRONIC APPARATUS
First Claim
1. A solid-state image sensing device comprising a barrier layer and a plated power supply layer as a redistribution layer,wherein crystallinity of a film of the plated power supply layer is controlled at the time of depositing a film of the barrier layer and the film of the plated power supply layer.
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Accused Products
Abstract
The present disclosure relates to a solid-state image sensing device, a manufacturing method, and an electronic apparatus, in which surface roughness on a wiring surface can be suppressed. In redistribution layer forming processing, a Ti/Cu film corresponds to a barrier layer and a seed layer is formed by Ti/Cu sputtering after opening a through-silicon via. At this point, actually, degassing heating, reverse sputtering, Ti deposition, and Seed-Cu deposition are sequentially performed. As a method of depositing a Seed-Cu film having high crystallinity in deposition of the Seed-Cu film, performing deposition by increasing a substrate temperature to a high temperature is one method, and the Seed-Cu film of Cu(111)/(200) is formed by performing deposition at the substrate temperature of 60 degrees or more, and Cu haze are suppressed. The present disclosure can be applied to, for example, a CMOS solid-state image sensing device used as an imaging device such as a camera.
3 Citations
11 Claims
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1. A solid-state image sensing device comprising a barrier layer and a plated power supply layer as a redistribution layer,
wherein crystallinity of a film of the plated power supply layer is controlled at the time of depositing a film of the barrier layer and the film of the plated power supply layer.
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10. A manufacturing method to control crystallinity of a film of a plated power supply layer when a manufacturing device of a solid-state image sensing device deposits a film of a barrier layer and the film of the plated power supply layer in a course of forming a redistribution layer.
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11. An electronic apparatus comprising a barrier layer and a plated power supply layer as redistribution layers,
wherein provided are: -
a solid-state image sensing device in which crystallinity of a film of the plated power supply layer is controlled at the time of depositing a film of the barrier layer and the film of the plated power supply layer; a signal processing circuit configured to process an output signal output from the solid-state image sensing device; and an optical system configured to allow incident light to enter the solid-state image sensing device.
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Specification