SEMICONDUCTOR DEVICE, MANUFACTURING METHOD, AND ELECTRONIC APPARATUS
First Claim
Patent Images
1. A semiconductor device, comprising:
- an image pickup device;
a cover glass, wherein the image pickup device and the cover glass are bonded to one another;
a film provided between the image pickup device and the cover glass, wherein the film has a specific gravity value of two or more and is configured to shield an alpha ray that arises from the cover glass; and
a transparent resin filled between the image pickup device and the cover glass,wherein the film is configured to cover an area of the transparent resin within a pixel region, and wherein the film is not provided at a portion other than the pixel region.
0 Assignments
0 Petitions
Accused Products
Abstract
A method of manufacturing a semiconductor device includes: forming, on a cover glass, a film having a predetermined specific gravity and configured to shield an alpha ray that arises from the cover glass; and bonding the cover glass on which the film is formed and an image pickup device, by filling a transparent resin between the cover glass and the image pickup device.
0 Citations
20 Claims
-
1. A semiconductor device, comprising:
-
an image pickup device; a cover glass, wherein the image pickup device and the cover glass are bonded to one another; a film provided between the image pickup device and the cover glass, wherein the film has a specific gravity value of two or more and is configured to shield an alpha ray that arises from the cover glass; and a transparent resin filled between the image pickup device and the cover glass, wherein the film is configured to cover an area of the transparent resin within a pixel region, and wherein the film is not provided at a portion other than the pixel region. - View Dependent Claims (2, 3, 4, 5)
-
-
6. A method of manufacturing a semiconductor device, the method comprising:
-
forming, on a cover glass, a film that has a specific gravity value of two or more and is configured to shield an alpha ray that arises from the cover glass; patterning the film; and bonding the cover glass on which the film is formed and an image pickup device, by filling a transparent resin between the cover glass and the image pickup device, wherein the film is configured to cover an entire area of the transparent resin within a pixel region, and wherein the film is not provided at a portion other than the pixel region. - View Dependent Claims (7, 8, 9)
-
-
10. An electronic apparatus provided with a semiconductor device and a signal processing section, wherein the signal processing section is configured to process a pixel signal outputted from the semiconductor device, the semiconductor device comprising:
-
an image pickup device; a cover glass, wherein the image pickup device and the cover glass are bonded to one another; a film provided between the image pickup device and the cover glass, wherein the film has a specific gravity value of two or more and is configured to shield an alpha ray that arises from the cover glass; and a transparent resin filled between the image pickup device and the cover glass, wherein the film is configured to cover an entire area of the transparent resin within a pixel region, and wherein the film is not provided at a portion other than the pixel region. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
-
Specification