WET TYPE PROCESSING APPARATUS FOR RESIN FILM

• US 20190024238A1
• Filed: 01/12/2016
• Published: 01/24/2019
• Est. Priority Date: 01/12/2016
• Status: Active Grant

• Current Assignee: Chuo Kikai Co., Ltd., JCU Corporation
• Original Assignee: Chuo Kikai Co., Ltd., JCU Corporation
• Inventors: KOHTOKU, Makoto, NAKAMARU, Yaichiro, SHINOZAKI, Yukio, AOKI, Tetsuya, MATSUKURA, Takashi, HASHIMOTO, Goki
• Granted Patent: US 10,640,875 B2
• Time in Patent Office: Days
• CPC Class Codes: C23C 18/1628 Specific elements or parts of the apparatus
• CPC Class Codes: C23C 18/1632 Features specific for the apparatus, e.g. layout of cells and of its equipment, multiple cells
• CPC Class Codes: C23C 18/32 Coating with nickel, cobalt or mixtures thereof with phosphorus or boron C23C18/50 takes precedence
• CPC Class Codes: H05K 1/0393 Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 2201/0154 Polyimide
• CPC Class Codes: H05K 2203/0165 Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing
• CPC Class Codes: H05K 2203/072 Electroless plating, e.g. finish plating or initial plating
• CPC Class Codes: H05K 2203/1545 Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
• CPC Class Codes: H05K 2203/163 Monitoring a manufacturing process
• CPC Class Codes: H05K 3/187 means therefor, e.g. baths, apparatus

Abstract

A wet type processing apparatus includes a processing bath for reserving inside the processing liquid and rendering the resin film pass through the processing liquid; a pair of conveyance members arranged on a loading side for the resin film of the processing bath and on a delivery side for resin film of the processing bath at a position higher than a liquid surface of the processing liquid reserved in the processing bath; and a spouting unit arranged between the pair of the conveyance members at a position lower than the conveyance members and formed with a circumferential surface having plural holes for spouting the processing liquid from the circumferential surface to change a direction of the resin film along the circumferential surface in a non-contact manner in the processing liquid according to spouted flows from the holes.

Claims

1-19. -19. (canceled)

20. A wet type processing apparatus for resin film in which a web formed resin film is dipped in a prescribed processing liquid for making a prescribed processing on the surface of the resin film, the wet type processing apparatus comprising:

a processing bath for reserving inside the processing liquid and rendering the resin film pass through the processing liquid;

a pair of conveyance members arranged on a loading side for the resin film of the processing bath and on a delivery side for resin film of the processing bath at a position higher than a liquid surface of the processing liquid reserved in the processing bath; and

a spouting unit arranged between the pair of the conveyance members at a position lower than the conveyance members and formed with a circumferential surface having a plurality of holes for spouting the processing liquid from the circumferential surface to change a direction of the resin film along the circumferential surface in a non-contact manner in the processing liquid according to spouted flows from the plurality of holes.

21. The wet type processing apparatus for resin film according to claim 20, wherein the spouting unit spouts from the plurality of holes in the circumferential surface the processing liquid supplied from a head tank disposed at a position higher than the processing bath.

22. The wet type processing apparatus for resin film according to claim 21, wherein the spouting unit is coupled to the head tank through a single pipe or a plurality of pipes, and wherein each pipe in the plurality of pipes can adjust a flow amount of the processing liquid.

23. The wet type processing apparatus for resin film according to claim 21, wherein the processing bath includes a bottom spouting portion arranged near a bottom thereof for supplying the processing liquid from the head tank.

24. The wet type processing apparatus for resin film according to claim 20, wherein the spouting unit has a circumferential surface whose part is in a cylindrical shape.

25. The wet type processing apparatus for resin film according to claim 24, wherein the spouting unit has the plurality of holes formed in the circumferential surface thereof for radially spouting the processing liquid from the spouting unit.

26. The wet type processing apparatus for resin film according to claim 20, further comprising a wall surface spouting unit arranged at a position higher than the spouting unit in the processing liquid for spouting the processing liquid from plurality of holes formed in the circumferential surface thereof.

27. The wet type processing apparatus for resin film according to claim 26, wherein the plurality of holes of the wall surface spouting unit are provided for spouting the processing liquid toward an inner wall of the processing bath.

28. The wet type processing apparatus for resin film according to claim 20, further comprising a second spouting portion arranged within the processing bath for providing spouting to a resin film surface opposite to a resin film surface receiving liquid pressure from the spouting unit.

29. The wet type processing apparatus for resin film according to claim 20, further comprising a feed sensor disposed in the processing bath for detecting a feeding status of the resin film being fed, wherein the pair of the conveyance members is controlled according to a signal from the feed sensor.

30. The wet type processing apparatus for resin film according to claim 20, further comprising a movable member arranged in the spouting unit for changing a spouting amount of the processing liquid spouted out of the spouting unit in a film width direction perpendicular to a conveyance direction of the resin film.

31. The wet type processing apparatus for resin film according to claim 20, further comprising a section wall arranged in the spouting unit for dividing the processing liquid spouting out of the spouting unit in a film width direction.

32. The wet type processing apparatus for resin film according to claim 20, wherein at least one of the pair of the conveyance members is a conveyance roller, and wherein the conveyance roller has a rotation shaft having an axial direction extending in a film width direction and is so controlled that the axial direction is made inclined when adjusted.

33. The wet type processing apparatus for resin film according to claim 20, wherein the resin film is conveyed in a non-contact manner with spouting flow from a conveyance unit arranged between the pair of the conveyance members and the spouting unit.

34. A wet type processing apparatus for resin film, processing a coating treatment of a conductive metal on a surface of the resin film by dipping in a prescribed processing liquid a web formed resin film adsorbing metal ion catalyst on the surface thereof, comprising:

a processing bath for reserving inside the processing liquid and rendering the resin film pass through the processing liquid;

a pair of conveyance members arranged on a loading side for the resin film of the processing bath and on a delivery side for resin film of the processing bath at a position higher than a liquid surface of the processing liquid reserved in the processing bath; and

a spouting unit arranged between the pair of the conveyance members at a position lower than the conveyance members and formed with a circumferential surface having a plurality of holes for spouting the processing liquid from the circumferential surface to change a direction of the resin film along the circumferential surface in a non-contact manner in the processing liquid according to spouted flows from the plurality of holes.

35. The wet type processing apparatus for resin film according to claim 34, wherein the processing liquid is an electroless metal plating liquid, and wherein a metal film formed with the electroless metal plating liquid functions as a seed layer for subsequent wet type formation of a metal film.

36. The wet type processing apparatus for resin film according to claim 34, wherein the resin film is a polyimide film or other high heat resistance insulation resin films.

37. The wet type processing apparatus for resin film according to claim 36, wherein the polyimide film has a thickness of 12.5 microns or lower.

38. The wet type processing apparatus for resin film according to claim 34, wherein the plurality of holes of the spouting unit provide a spouting flow of 100 liters or less per minute.