SENSOR

• US 20190025087A1
• Filed: 02/14/2017
• Published: 01/24/2019
• Est. Priority Date: 02/17/2016
• Status: Active Grant

• Current Assignee: Continental Teves AG & Co. OHG (Continental AG)
• Original Assignee: Continental Teves AG & Co. OHG (Continental AG)
• Inventors: Acker, Heinrich
• Granted Patent: US 10,866,120 B2
• Time in Patent Office: Days
• CPC Class Codes: G01B 11/26 for measuring angles or tapers; for testing the alignment of axes
• CPC Class Codes: G01B 7/003 for measuring position, not involving coordinate determination coordinate measuring G01B7/004
• CPC Class Codes: G01B 7/14 for measuring distance or clearance between spaced objects or spaced apertures G01B7/30 takes precedence
• CPC Class Codes: G01B 7/30 for measuring angles or tapers; for testing the alignment of axes
• CPC Class Codes: G01D 3/08 with provision for safeguarding the apparatus, e.g. against abnormal operation, against breakdown
• CPC Class Codes: G01D 5/12 using electric or magnetic means G01D5/06 takes precedence
• CPC Class Codes: G01D 5/14 influencing the magnitude of a current or voltage
• CPC Class Codes: G01D 5/145 influenced by the relative movement between the Hall device and magnetic fields see G01R33/06
• CPC Class Codes: G01D 5/147 influenced by the movement of a third element, the position of Hall device and the source of magnetic field being fixed in respect to each other
• CPC Class Codes: G01D 5/2033 controlling the saturation of a magnetic circuit by means of a movable element, e.g. a magnet
• CPC Class Codes: G01D 5/2046 by a movable ferromagnetic element, e.g. a core
• CPC Class Codes: G01D 5/225 by influencing the mutual induction between the two coils

Abstract

A sensor, which is based on a coupling between a printed circuit board inductance and a number of attachment inductances that are applied using SMD technology.

Claims

1. A sensor, having

a circuit carrier,

a number of attachment inductances, and

at least one printed circuit board inductance, which is coupled to the attachment inductances,

wherein the attachment inductances are applied to the circuit carrier using SMD technology.

2. The sensor as claimed in claim 1,

wherein the printed circuit board inductance is implemented underneath the attachment inductances in the circuit carrier.

3. The sensor as claimed in claim 1,

wherein the printed circuit board inductance is implemented in the form of a number of conductor tracks in the circuit carrier.

4. The sensor as claimed in claim 1,

wherein the attachment inductances are electrically connected in series.

5. The sensor as claimed in claim 1,

wherein the attachment inductances are each individually connected to an electronic control unit.

6. The sensor as claimed in claim 1,

which also has a measurement body, which can be moved relative to the circuit carrier.

7. The sensor as claimed in claim 6,

wherein the measurement body can be moved with respect to position and/or location relative to the circuit carrier;

and/or

wherein the measurement body is ferromagnetic and/or electrically conductive.

8. The sensor as claimed in claim 6,

wherein the measurement body is embodied in a planar and/or multipart manner;

and/or

wherein the measurement body is embedded in an elastically deformable object.

9. The sensor as claimed in claim 1,

which is embodied as a position and/or force sensor.

10. The sensor as claimed in claim 1,

wherein the attachment inductances are arranged along a path or a circumference.

11. The sensor as claimed in claim 1,

wherein the printed circuit board inductance is a reference inductance and the attachment inductances are respective measurement inductances;

or

wherein at least one of the attachment inductances is a reference inductance and the printed circuit board inductance is a measurement inductance.

12. The sensor as claimed in claim 11,

wherein at least some of the measurement inductances are electrically interconnected in series and/or in parallel.

13. The sensor as claimed in claim 11,

wherein the reference inductance generates a magnetic field when current flows through, said magnetic field penetrating the measurement inductances and being changed by the measurement body depending on the position and/or the location of the measurement body.

14. The sensor as claimed in claim 11, further having:

a capacitance, which is interconnected with the reference inductance to form a parallel resonant circuit, and

an electronic control unit,

wherein the electronic control unit is connected directly to the parallel resonant circuit and is configured to excite the parallel resonant circuit into oscillation at an excitation frequency that is derived from a clock of the electronic control unit, and

wherein the electronic control unit is connected directly to each of the measurement inductances and is configured to measure a value, which indicates at least one measurement variable, at the respective measurement inductance.

15. The sensor as claimed in claim 11,

which has a plurality of measurement inductances,

wherein each measurement inductance has a magnet core associated therewith,

wherein the measurement inductances are arranged along a path,

wherein the measurement inductances are electrically connected in series, and

wherein the measurement inductances have respective inductances, which increase along the path in one direction.

16. The sensor as claimed in claim 7,

wherein the measurement body is embodied in a planar and/or multiparty manner;

and/or

wherein the measurement body is embedded in an elastically deformable object.

17. The sensor as claimed in claim 12,

wherein the reference inductance generates a magnetic field when current flows through, said magnetic field penetrating the measurement inductances and being changed by the measurement body depending on the position and/or the location of the measurement body.