TOUCH DISPLAY PANEL AND DISPLAY DEVICE

• US 20190025967A1
• Filed: 08/17/2017
• Published: 01/24/2019
• Est. Priority Date: 07/20/2017
• Status: Active Grant

• Current Assignee: Wuhan China Star Optoelectronics Technology Co., Ltd. (TCL Technology Group Corp.)
• Original Assignee: Wuhan China Star Optoelectronics Technology Co., Ltd. (TCL Technology Group Corp.)
• Inventors: TANG, Yuejun, LI, DE-JIUN, SONG, Wenqing, YANG, TSUNG-YING, DU, Mingfei
• Granted Patent: US 10,459,556 B2
• Time in Patent Office: Days
• CPC Class Codes: G02F 1/13338 Input devices, e.g. touch panels
• CPC Class Codes: G06F 1/1626 with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
• CPC Class Codes: G06F 1/1637 Details related to the display arrangement, including those related to the mounting of the display in the housing
• CPC Class Codes: G06F 1/1643 the display being associated to a digitizer, e.g. laptops that can be used as penpads details related to the relative motion of the display enclosure with respect to the body enclosure, e.g. to move between laptop and tablet PC configuration G06F1/1615
• CPC Class Codes: G06F 3/0412 Digitisers structurally integrated in a display
• CPC Class Codes: G06F 3/04164 Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
• CPC Class Codes: G06F 3/0443 using a single layer of sensing electrodes
• CPC Class Codes: G06F 3/0445 using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
• CPC Class Codes: H01L 23/488 consisting of soldered or bonded constructions bump connectors H01L24/01
• CPC Class Codes: H01L 24/26 Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto

Abstract

A touch display panel and a display device are disclosed. The touch display panel includes a first substrate, a second substrate, a first solder pad, a second solder pad and a touch sensing layer. The first substrate is defined with a display region and a non-display region. In the present invention, the first solder pad is disposed at a substrate having the touch sensing layer. That is, the first substrate is provided with a non-display region having the second solder pad. A wider black masking region for the first solder pad and corresponding trace region is not required so that an edge frame of the display device can be reduced, which is beneficial for a narrow-frame design of the display device.

Claims

1. A touch display panel, comprising:

a first substrate defined with a display region and a non-display region;

a second substrate disposed opposite to the first substrate, wherein the first substrate is an upper substrate relative to the second substrate, and the second substrate is a lower substrate relative to the first substrate;

a first solder pad;

a second solder pad; and

a touch sensing layer disposed on a side of the first substrate away from the second substrate;

wherein, the first solder pad and the second solder pad are disposed at the non-display region of the first substrate, the first solder pad is connected to the touch control circuit, and the second solder pad is connected to a display driving circuit; and

wherein, the first solder pad and the second solder pad are disposed at a solder region of the first substrate that is in parallel with the non-display region and next to a boundary of the display region, a width of the solder region measured closest to the boundary and farthest away from the boundary is less than a sum of a width of the first solder pad and a width of the second solder pad.

2. The touch display panel according to claim 1, wherein, the first solder pad and the second solder pad are disposed oppositely at two sides of the non-display region of the first substrate.

3. The touch display panel according to claim 1, wherein,

the first solder pad and the second solder pad includes a group of lead pins, a projection of the lead pins of the first solder pad on the first substrate is overlapped with a projection of the lead pins of the second solder pad on the first substrate.

4. The touch display panel according to claim 1, wherein,

the first substrate is a thin-film transistor substrate, the second substrate is a color filter substrate;

or the first substrate is a COA substrate, and a side of the second substrate close to the first substrate is covered with a buffering layer.

5. The touch display panel according to claim 1, wherein,

the touch display panel is a transmissive liquid crystal display panel, and a thin-film transistor of the first substrate is a top-gate type thin-film transistor;

or

the touch display panel is a reflective liquid crystal display panel or a transflective liquid crystal display panel, a thin-film transistor of the first substrate is a top-gate type thin-film transistor or a bottom-gate type thin-film transistor.

6. A touch display panel, comprising:

a first substrate defined with a display region and a non-display region;

a second substrate disposed opposite to the first substrate, wherein the first substrate is an upper substrate relative to the second substrate, and the second substrate is a lower substrate relative to the first substrate;

a first solder pad;

a second solder pad; and

a touch sensing layer disposed on a side of the first substrate away from the second substrate;

wherein, the first solder pad and the second solder pad are disposed at the non-display region of the first substrate, the first solder pad is connected to the touch control circuit, and the second solder pad is connected to a display driving circuit.

7. The touch display panel according to claim 6, wherein, the first solder pad and the second solder pad are disposed oppositely at two sides of the non-display region of the first substrate.

8. The touch display panel according to claim 6, wherein, the first solder pad and the second solder pad includes a group of lead pins, a projection of the lead pins of the first solder pad on the first substrate is overlapped with a projection of the lead pins of the second solder pad on the first substrate.

9. The touch display panel according to claim 6, wherein,

the first substrate is a thin-film transistor substrate, the second substrate is a color filter substrate;

or the first substrate is a COA substrate, and a side of the second substrate close to the first substrate is covered with a buffering layer.

10. The touch display panel according to claim 8, wherein,

the first substrate is a thin-film transistor substrate, the second substrate is a color filter substrate;

or the first substrate is a COA substrate, and a side of the second substrate close to the first substrate is covered with a buffering layer.

11. The touch display panel according to claim 6, wherein, the touch display panel is a panel that adopts a FFS display mode.

12. The touch display panel according to claim 6, wherein, the touch display panel is an on-cell touch display panel.

13. The touch display panel according to claim 6, wherein, the touch display panel is a transmissive liquid crystal display panel, and a thin-film transistor of the first substrate is a top-gate type thin-film transistor;

or

the touch display panel is a reflective liquid crystal display panel or a transflective liquid crystal display panel, a thin-film transistor of the first substrate is a top-gate type thin-film transistor or a bottom-gate type thin-film transistor.

14. A display device, comprising:

a touch display panel, comprising;

a first substrate defined with a display region and a non-display region;

a second substrate disposed opposite to the first substrate, wherein the first substrate is an upper substrate relative to the second substrate, and the second substrate is a lower substrate relative to the first substrate;

a first solder pad;

a second solder pad; and

a touch sensing layer disposed on a side of the first substrate away from the second substrate;

wherein, the first solder pad and the second solder pad are disposed at the non-display region of the first substrate, the first solder pad is connected to the touch control circuit, and the second solder pad is connected to a display driving circuit.

15. The display device according to claim 14, wherein, the first solder pad and the second solder pad are disposed oppositely at two sides of the non-display region of the first substrate.

16. The display device according to claim 14, wherein, the first solder pad and the second solder pad are disposed at a solder region of the first substrate that is in parallel with the non-display region and next to a boundary of the display region, a width of the solder region measured closest to the boundary and farthest away from the boundary is less than a sum of a width of the first solder pad and a width of the second solder pad.

17. The display device according to claim 14, wherein, the first solder pad and the second solder pad includes a group of lead pins, and a projection of the lead pins of the first solder pad on the first substrate is overlapped with a projection of the lead pins of the second pad on the first substrate.

18. The display device according to claim 14, wherein, the first substrate is a thin-film transistor substrate, the second substrate is a color filter substrate;

or the first substrate is a COA substrate, and a side of the second substrate close to the first substrate is covered with a buffering layer.

19. The display device according to claim 14, wherein, the touch display panel is a panel that adopts a FFS display mode.

20. The display device according to claim 14, wherein, the touch display panel is a transmissive liquid crystal display panel, and a thin-film transistor of the first substrate is a top-gate type thin-film transistor;

or

the touch display panel is a reflective liquid crystal display panel or a transflective liquid crystal display panel, a thin-film transistor of the first substrate is a top-gate type thin-film transistor or a bottom-gate type thin-film transistor.