PACKAGE STRUCTURE OF FINGERPRINT IDENTIFICATION CHIP

• US 20190026533A1
• Filed: 12/04/2017
• Published: 01/24/2019
• Est. Priority Date: 07/21/2017
• Status: Active Grant

• Current Assignee: Primax Electronics Limited
• Original Assignee: Primax Electronics Limited
• Inventors: Lu, Tsung-Yi
• Granted Patent: US 10,445,553 B2
• Time in Patent Office: Days
• CPC Class Codes: G06V 40/1329 Protecting the fingerprint sensor against damage caused by the finger
• CPC Class Codes: G06V 40/1365 Matching; Classification
• CPC Class Codes: H01L 21/50 Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
• CPC Class Codes: H01L 2224/04042 Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
• CPC Class Codes: H01L 2224/29194 with a principal constituent of the material being a liquid not provided for in groups H01L2224/291 - H01L2224/29191
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/33181 On opposite sides of the body
• CPC Class Codes: H01L 2224/48106 the connector being orthogonal to a side surface of the semiconductor or solid-state body, e.g. parallel layout
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/4824 Connecting between the body and an opposite side of the item with respect to the body
• CPC Class Codes: H01L 2224/73215 Layer and wire connectors
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/8592 Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 2224/92147 the second connecting process involving a wire connector
• CPC Class Codes: H01L 2224/92247 the second connecting process involving a wire connector
• CPC Class Codes: H01L 23/04 characterised by the shape of the container or parts, e.g. caps, walls
• CPC Class Codes: H01L 23/08 the material being an electrical insulator, e.g. glass
• CPC Class Codes: H01L 23/10 characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
• CPC Class Codes: H01L 23/13 characterised by the shape
• CPC Class Codes: H01L 23/14 : characterised by the material or its electrical properties printed circuit boards H05K1/00
• CPC Class Codes: H01L 23/142 : Metallic substrates having insulating layers
• CPC Class Codes: H01L 23/3142 : Sealing arrangements between parts, e.g. adhesion promotors
• CPC Class Codes: H01L 23/4985 : Flexible insulating substrates H01L23/49572 and H01L23/49855 take precedence
• CPC Class Codes: H01L 24/05 : of an individual bonding area
• CPC Class Codes: H01L 24/29 : of an individual layer connector
• CPC Class Codes: H01L 24/32 : of an individual layer connector
• CPC Class Codes: H01L 24/33 : of a plurality of layer connectors
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/92 : Specific sequence of method steps
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/3511 : Warping

Abstract

The present invention provides a package structure of a fingerprint identification chip, including: a metal substrate, having a through opening and two grooves extending from two opposite sides of the through opening; a fingerprint identification chip, disposed in the through opening and having an upper surface and a lower surface, the lower surface having a bonding pad; a cover plate, fixedly disposed on the metal substrate and covering the upper surface of the fingerprint identification chip; a flexible printed circuit (FPC), disposed on the lower surface of the fingerprint identification chip and having a first surface and a second surface, the second surface having a first metal contact; and a metal reinforcing plate, inserted into the two grooves and covering the through opening, where the bonding pad is electrically connected to the first metal contact through a wire.

Claims

1. A package structure of a fingerprint identification chip, comprising:

a metal substrate, having a through opening and two grooves extending from two opposite sides of the through opening;

a fingerprint identification chip, disposed in the through opening and having an upper surface and a lower surface, the lower surface having at least one bonding pad;

a cover plate, fixedly disposed on the metal substrate and covering the upper surface of the fingerprint identification chip;

a flexible printed circuit (FPC), disposed on the lower surface of the fingerprint identification chip and having a first surface and a second surface, the second surface having a first metal contact; and

a metal reinforcing plate, inserted into the two grooves and covering the through opening;

wherein the bonding pad is electrically connected to the first metal contact through a wire.

2. The package structure of a fingerprint identification chip according to claim 1, wherein a colloid is coated on the at least one bonding pad, the wire and the first metal contact, and the colloid is an underfill.

3. The package structure of a fingerprint identification chip according to claim 1, wherein a film layer is formed between the metal substrate and the cover plate and is used for bonding the metal substrate and the cover plate.

4. The package structure of a fingerprint identification chip according to claim 1, wherein the cover plate includes a first mucilage layer that is formed at a position corresponding to the through opening and used for bonding the upper surface of the fingerprint identification chip.

5. The package structure of a fingerprint identification chip according to claim 1, wherein a second mucilage layer is formed between the lower surface of the fingerprint identification chip and the first surface of the FPC and is used for bonding the fingerprint identification chip and the FPC.

6. The package structure of a fingerprint identification chip according to claim 1, wherein a second metal contact is formed at another end, which is opposite to the first metal contact, of the FPC.

7. The package structure of a fingerprint identification chip according to claim 1, wherein the metal reinforcing plate has a circuit opening.

8. The package structure of a fingerprint identification chip according to claim 7, wherein the FPC passes through the circuit opening.

9. The package structure of a fingerprint identification chip according to claim 8, wherein at a position of the circuit opening, a bent portion is formed on the FPC.

10. The package structure of a fingerprint identification chip according to claim 9, wherein a colloid is coated on the circuit opening and the bent portion, and the colloid is an underfill.

11. The package structure of a fingerprint identification chip according to claim 1, wherein a material of the metal substrate is:

stainless steel, tungsten steel, aluminum or tin plate.

12. The package structure of a fingerprint identification chip according to claim 1, wherein a material of the cover plate is:

ceramic or glass.

13. The package structure of a fingerprint identification chip according to claim 1, wherein a material of the metal reinforcing plate is:

stainless steel, tungsten steel, aluminum or tin plate.

14. The package structure of a fingerprint identification chip according to claim 1, wherein the thickness of the metal substrate is between 430 μ

m and 450 μ

m.

15. The package structure of a fingerprint identification chip according to claim 14, wherein the thickness of the metal substrate is 440 μ

m.

16. The package structure of a fingerprint identification chip according to claim 1, wherein the thickness of the cover plate is between 110 μ

m and 130 μ

m.

17. The package structure of a fingerprint identification chip according to claim 16, wherein the thickness of the cover plate is 120 μ

m.