MULTI-ELECTRODE MOLECULAR SENSING DEVICES AND METHODS OF MAKING THE SAME
First Claim
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1. A method of manufacturing a molecular sensor, the method comprising:
- forming a stack by at least;
providing a first outer dielectric layer;
depositing a first electrode layer on the first outer dielectric layer;
depositing an inner dielectric layer on the first electrode layer;
depositing a second electrode layer on the inner dielectric layer; and
depositing a second outer dielectric layer on the second electrode layer;
slicing through the stack at least once at an angle to the layers in the stack to form a plurality of chips from the sliced portions of the stack; and
attaching the plurality of chips to a substrate so that the sliced portions of the first electrode layer and the second electrode layer form a plurality of pairs of electrode sheets at an angle to a substrate plane defined by the substrate, and so that the sliced portions of the inner dielectric layer forms a plurality of inner dielectric sheets with each inner dielectric sheet between each electrode sheet in each pair of electrode sheets.
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Abstract
A molecular sensor includes a substrate defining a substrate plane, and a plurality of pairs of electrode sheets above or below the substrate at an angle to the substrate plane. The molecular sensor further includes a plurality of inner dielectric sheets between each electrode sheet in each pair of electrode sheets of the plurality of pairs, and an outer dielectric sheet between each pair of electrode sheets of the plurality of pairs.
23 Citations
8 Claims
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1. A method of manufacturing a molecular sensor, the method comprising:
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forming a stack by at least; providing a first outer dielectric layer; depositing a first electrode layer on the first outer dielectric layer; depositing an inner dielectric layer on the first electrode layer; depositing a second electrode layer on the inner dielectric layer; and depositing a second outer dielectric layer on the second electrode layer; slicing through the stack at least once at an angle to the layers in the stack to form a plurality of chips from the sliced portions of the stack; and attaching the plurality of chips to a substrate so that the sliced portions of the first electrode layer and the second electrode layer form a plurality of pairs of electrode sheets at an angle to a substrate plane defined by the substrate, and so that the sliced portions of the inner dielectric layer forms a plurality of inner dielectric sheets with each inner dielectric sheet between each electrode sheet in each pair of electrode sheets. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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Specification