Method and Plater Arrangement for Failure-Free Copper Filling of a Hole in a Component Carrier
First Claim
1. A method of filling a hole formed in a component carrier with copper, the method comprising:
- forming a layer of an electrically conductive material covering at least part of a surface of a wall, wherein the wall delimits the hole; and
subsequently, covering at least partially the layer and filling at least partially an unfilled volume of the hole with copper using a plating process including a bath,wherein the bath comprises a concentration of a copper ion in a range between 50 g/L and 75 g/L.
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Accused Products
Abstract
A method of filling a hole formed in a component carrier with copper is disclosed. The method comprises i) forming a layer of an electrically conductive material covering at least part of a surface of a wall, wherein the wall delimits the hole, and subsequently ii) covering at least partially the layer and filling at least partially an unfilled volume of the hole with copper using a plating process including a bath. Hereby, the bath comprises a concentration of a copper ion, in particular Cu2+, in a range between 50 g/L and 75 g/L, in particular in a range between 60 g/L and 70 g/L.
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Citations
20 Claims
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1. A method of filling a hole formed in a component carrier with copper, the method comprising:
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forming a layer of an electrically conductive material covering at least part of a surface of a wall, wherein the wall delimits the hole; and subsequently, covering at least partially the layer and filling at least partially an unfilled volume of the hole with copper using a plating process including a bath, wherein the bath comprises a concentration of a copper ion in a range between 50 g/L and 75 g/L. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. A component carrier, comprising:
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a stack of at least one electrically insulating layer structure and at least one electrically conductive material layer structure, wherein the component carrier has been manufactured by forming a layer of an electrically conductive material covering at least part of a surface of a wall, wherein the wall delimits a hole; and subsequently, covering at least partially the layer and filling at least partially an unfilled volume of the hole with copper using a plating process including a bath, wherein the bath comprises a concentration of a copper ion in a range between 50 g/L and 75 g/L. - View Dependent Claims (18, 19)
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20. A plater arrangement for filling a hole formed in a component carrier with copper, the plater arrangement comprising:
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an electro-less plater section for forming a layer of an electrically conductive material, which layer covers at least part of a surface of a wall of a component carrier, wherein the wall delimits the hole in the component carrier; and an electro-plater section for covering at least partially the layer and filling at least partially an unfilled volume of the hole with copper by an electro-plating process, wherein the electro-plater section includes a bath for plating with copper, the bath having a concentration of a copper ion in a range between 50 g/L and 75 g/L.
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Specification