CIRCUIT ASSEMBLY AND ELECTRICAL JUNCTION BOX

• US 20190045618A1
• Filed: 09/06/2016
• Published: 02/07/2019
• Est. Priority Date: 09/11/2015
• Status: Active Grant

• Current Assignee: Autonetworks Technologies, Ltd. (Sumitomo Corporation), Sumitomo Electric Industries Limited (Sumitomo Corporation), Sumitomo Wiring Systems Limited (Sumitomo Corporation)
• Original Assignee: Autonetworks Technologies, Ltd. (Sumitomo Corporation), Sumitomo Electric Industries Limited (Sumitomo Corporation), Sumitomo Wiring Systems Limited (Sumitomo Corporation)
• Inventors: Ota, Takuya, Yamane, Shigeki, Maeda, Hirotoshi, Tsuchida, Toshiyuki, Tozawa, Yoshihiro
• Granted Patent: US 10,448,497 B2
• Time in Patent Office: Days
• CPC Class Codes: H05K 1/0204 using means for thermal conduction connection in the thickness direction of the substrate H05K1/0207 takes precedence
• CPC Class Codes: H05K 1/0271 Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
• CPC Class Codes: H05K 1/181 associated with surface mounted components
• CPC Class Codes: H05K 2201/066 Heatsink mounted on the surface of the PCB heatsink inserted in the PCB H05K2201/10416
• CPC Class Codes: H05K 2201/068 wherein the coefficient of thermal expansion is important
• CPC Class Codes: H05K 2201/1009 Electromotor
• CPC Class Codes: H05K 2201/10113 Lamp
• CPC Class Codes: H05K 7/1427 Housings
• CPC Class Codes: H05K 7/209 Heat transfer by conduction from internal heat source to heat radiating structure H05K7/20909 takes precedence

Abstract

A circuit assembly includes a circuit board on which a coil is mounted, a heat sink, and a heat spreading plate that is separate from this heat sink. A first insulating adhesive layer is interposed between the circuit board and the heat spreading plate, and the heat spreading plate and the heat sink are fixed by a first fixing hole for a heat sink and a bolt. Accordingly, warping of the circuit board is suppressed.

Claims

1. A circuit assembly comprising:

a circuit board on which an electronic component is mounted;

a heat dissipation plate; and

a heat spreading plate that is separate from the heat dissipation plate,

wherein an insulating adhesive layer is interposed between the circuit board and the heat spreading plate,

the heat spreading plate and the heat dissipation plate are fixed to each other by fixing means, and

the heat dissipation plate is provided with a positioning portion for positioning the heat spreading plate.

3. The circuit assembly according to claim 1,

wherein the heat spreading plate is fixed to the heat dissipation plate in a state in which the heat spreading plate is pressed against the heat dissipation plate.

4. The circuit assembly according to claim 1,

wherein the circuit board and the heat spreading plate are fixed to the heat dissipation plate in a state in which the circuit board and the heat spreading plate are pressed against the heat dissipation plate.

5. The circuit assembly according to claim 1,

wherein the adhesive layer is made of a thermally conductive material.

6. The circuit assembly according to claim 1,

wherein the electronic component has a lead terminal,

the lead terminal is mounted passing through the circuit board, and

a lead terminal escape hole is provided in a region of the heat spreading plate that corresponds to at least the lead terminal.

7. The circuit assembly according to claim 6,

wherein the lead terminal escape hole passes through the heat spreading plate, and

the heat dissipation plate is provided with, in a region that is opposite to the lead terminal, an escape recess that is recessed away from the heat spreading plate.

8. The circuit assembly according to claim 1,

wherein the electronic component is a surface-mount type component.

9. An electrical junction box in which the circuit assembly according to claim 1 is accommodated in a case.

2. (canceled)

10. A circuit assembly comprising:

a circuit board on which an electronic component is mounted,

a heat dissipation plate; and

a heat spreading plate that is separate from the heat dissipation plate,

wherein an insulating adhesive layer is interposed between the circuit board and the heat spreading plate,

the heat spreading plate and the heat dissipation plate are fixed to each other by fixing means,

the electronic component has a lead terminal,

the lead terminal is mounted passing through the circuit board, and

a lead terminal escape hole is provided in a region of the heat spreading plate that corresponds to at least the lead terminal.

11. The circuit assembly according to claim 10,

the lead terminal escape hole passes through the heat spreading plate, and

the heat dissipation plate is provided with, in a region that is opposite to the lead terminal, an escape recess that is recessed away from the heat spreading plate.