PROTECTING ANODIZED SURFACES DURING MANUFACTURING PROCESSES
First Claim
1. A part, comprising:
- an anodic film on a metal substrate, the anodic film having a first section and a second section,wherein the first section is characterized as having a substantially fully sealed pore, andwherein the second section is characterized as having a partially sealed pore.
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Accused Products
Abstract
Treatments for anodic coatings that provide improved resistance to staining and cracking during various manufacturing processes are described. According to some embodiments, the methods include placing the anodic coatings in partially sealed states by sealing only the outermost portions of the anodic coatings, which protect the outer surfaces of the anodic coatings from contamination and staining. Inner portions of the anodic coatings are left unsealed, thereby making the anodic coatings more compliant and resistant to cracking when exposed to manufacturing processes, even those that involve exposure to high temperatures or high mechanical stress. Subsequent to the processing, another sealing process can be implemented to fully seal the anodic coatings so that they provide good corrosion and wear resistance.
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Citations
20 Claims
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1. A part, comprising:
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an anodic film on a metal substrate, the anodic film having a first section and a second section, wherein the first section is characterized as having a substantially fully sealed pore, and wherein the second section is characterized as having a partially sealed pore. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method of treating a part having an anodic film on a metal substrate, the method comprising:
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partially sealing the anodic film; performing one or more manufacturing operations on the part; and substantially fully sealing at least a section of the anodic film. - View Dependent Claims (12, 13, 14, 15, 16, 17)
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18. A part, comprising:
an anodic film integrally bonded to a metal substrate at an interface and having an outer surface opposite the interface, wherein an outermost one micrometer of the anodic film is characterized as having a nickel concentration of at least 20 weight %, and an interior portion of the anodic film between the outermost one micrometer and the interface is characterized as having a nickel concentration of no more than about 1 weight %. - View Dependent Claims (19, 20)
Specification