PACKAGED INTEGRATED CIRCUIT HAVING STACKED DIE AND METHOD FOR THEREFOR
First Claim
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1. A packaged integrated circuit (IC) device comprising:
- a first IC die;
a first inductor in the first IC die;
a first layer of adhesive on a first major surface of the first IC die;
an isolation layer over the first layer of adhesive;
a second layer of adhesive on the isolation layer;
a second IC die on the second layer of adhesive;
a second inductor in the second IC die aligned to communicate with the first inductor,wherein the isolation layer extends a prespecified distance beyond a first edge of the second IC die.
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Abstract
A packaged integrated circuit (IC) device includes a first IC die with a first inductor, a first layer of adhesive on a first major surface of the first IC die, an isolation layer over the first layer of adhesive, a second layer of adhesive on the isolation layer, a second IC die on the second layer of adhesive, and a second inductor in the second IC die aligned to communicate with the first inductor. The isolation layer extends a prespecified distance beyond a first edge of the second IC die.
13 Citations
20 Claims
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1. A packaged integrated circuit (IC) device comprising:
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a first IC die; a first inductor in the first IC die; a first layer of adhesive on a first major surface of the first IC die; an isolation layer over the first layer of adhesive; a second layer of adhesive on the isolation layer; a second IC die on the second layer of adhesive; a second inductor in the second IC die aligned to communicate with the first inductor, wherein the isolation layer extends a prespecified distance beyond a first edge of the second IC die. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 11, 12, 13, 14)
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9. A method of making a packaged integrated circuit (IC) device comprising:
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attaching a bottom side of a first IC die to a flag of a lead frame, wherein the first IC die includes a first inductor; attaching an isolation barrier to a top side of the first IC die with a first adhesive layer between the top side of the first IC die and a bottom side of the isolation barrier; attaching a second IC die to a top side of the isolation barrier with a second adhesive layer between the top side of the isolation barrier and a bottom side of the second IC die, wherein the second IC die includes a second inductor positioned to communicate signals to and from the first inductor, and the isolation barrier extends beyond a first edge of the second die a distance sufficient to be greater than or equal to a specified creepage distance. - View Dependent Claims (10, 15, 16, 17, 18, 19, 20)
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Specification