ALUMINUM-DIAMOND-BASED COMPOSITE AND HEAT DISSIPATION COMPONENT

• US 20190093201A1
• Filed: 12/27/2016
• Published: 03/28/2019
• Est. Priority Date: 03/15/2016
• Status: Active Grant

• Current Assignee: Denka Company Limited
• Original Assignee: Denka Company Limited
• Inventors: ISHIHARA, Yosuke, MIYAKAWA, Takeshi, TSUKAMOTO, Hideo, KOYANAGI, Kazunori
• Granted Patent: US 10,640,853 B2
• Time in Patent Office: Days
• CPC Class Codes: B22F 2003/247 Removing material: carving, cleaning, grinding, hobbing, honing, lapping, polishing, milling, shaving, skiving, turning the surface
• CPC Class Codes: B22F 2007/045 accompanied by fusion or impregnation
• CPC Class Codes: B22F 2301/052 Aluminium
• CPC Class Codes: B22F 2302/406 Diamond
• CPC Class Codes: B22F 3/17 by forging
• CPC Class Codes: B22F 3/26 Impregnating making ferrous alloys by impregnation C22C33/0242
• CPC Class Codes: C22C 1/0416 Aluminium-based alloys
• CPC Class Codes: C22C 1/05 Mixtures of metal powder with non-metallic powder C22C1/08 takes precedence
• CPC Class Codes: C22C 21/02 with silicon as the next major constituent
• CPC Class Codes: C22C 26/00 Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes
• CPC Class Codes: H01L 23/34 Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements thermal treatment apparatus H01L21/00
• CPC Class Codes: H01L 23/3732 Diamonds
• CPC Class Codes: H01L 23/3736 Metallic materials H01L23/3732, H01L23/3733, H01L23/3735, H01L23/3737, H01L23/3738 take precedence

Abstract

Provided is an aluminum-diamond-based composite which can be processed with high dimensional accuracy. The flat-plate-shaped aluminum-diamond-based composite is coated with a surface layer of which the entire surface has an average film thickness of 0.01-0.2 mm and which contains not less than 80 volume % of a metal containing an aluminum.

Claims

1. An aluminum-diamond-based composite in a form of a flat plate, the aluminum-diamond-based composite comprising an overall surface coated with a surface layer having an average film thickness of from 0.01 to 0.2 mm, the surface layer containing 80% by volume or more of a metal containing aluminum.

2. The aluminum-diamond-based composite according to claim 1, wherein the aluminum-diamond-based composite has a frequency distribution of a particle size on volume basis in which a first peak is at a particle diameter of from 5 to 25 μ

m and a second peak is at a particle diameter of from 55 to 195 μ

m, and one of the first peak and the second peak is the highest peak and the other is the second highest peak; and

wherein the aluminum-diamond-based composite comprises from 50% to 80% by volume of diamond powder, the diamond powder having a ratio of an area (A₁) of a particle size of from 1 to 35 μ

m to an area (A₂) of a particle size of from 45 to 205 μ

m of A₁;

A₂=from 1;

9 to 4;

6.

3. The aluminum-diamond-based composite according to claim 1, wherein each edge and thickness of the aluminum-diamond-based composite has a dimensional error of ±

0.020 mm or less.

4. The aluminum-diamond-based composite according to claim 1, wherein the aluminum-diamond-based composite comprises a surface metal layer on the surface layer, the surface metal layer being comprised of a Ni layer having a film thickness of from 0.5 μ

m to 6.5 μ

m and an Au layer having a film thickness of 0.05 μ

m or more, in this order from the surface layer side.

5. The aluminum-diamond-based composite according to claim 4, wherein the surface metal layer has a peel strength of 50 N/cm or more.

6. The aluminum-diamond-based composite according to claim 1, wherein the overall surface has a surface roughness (Ra) of 1 μ

m or less.

7. The aluminum-diamond-based composite according to claim 1, wherein the aluminum-diamond-based composite has a thermal conductivity of 400 W/mK or more at a temperature of 25°

C.

8. The aluminum-diamond-based composite according to claim 1, wherein the aluminum-diamond-based composite has a linear expansion coefficient of from 5×

10<sup>−

6</sup> to 10×

10<sup>−

6</sup>/K in a temperature range of from 25°

C. to 150°

C.

9. The aluminum-diamond-based composite according to claim 1, wherein each diamond particle forming the diamond powder comprises a layer of β

-type silicon carbide chemically bonded to the surface of each diamond particle.

10. A heat dissipation component for a semiconductor element, comprising the aluminum-diamond-based composite according to claim 1.

11. The heat dissipation component for the semiconductor element according to claim 10, wherein the semiconductor element comprises a semiconductor laser element or a high frequency element made of GaN, GaAs or SiC.

12. A method for producing an aluminum-diamond-based composite comprising an overall surface coated with a surface layer, the method comprising:

1) preparing diamond powder;

2) preparing at least one aluminum-containing material selected from ceramics containing aluminum and metal materials containing aluminum;

3) filling a cavity of a porous mold member with the diamond powder in a state where the aluminum-containing material is placed on top and bottom surfaces of a layer of the diamond powder and the layer of the diamond powder is further sandwiched by mold release plates from top and bottom sides; and

impregnating the diamond powder with the metal containing aluminum by a molten metal forging method to prepare an aluminum-diamond-based composite precursor having a flat plate shape comprising a surface layer containing 80% by volume or more of a metal containing aluminum on top and bottom surfaces of the precursor; and

4) filling a cavity of a porous mold member with the precursor in a state where the aluminum-containing material is placed on all side surfaces of the precursor and mold release plates are placed on both top and bottom surfaces of the precursor; and

impregnating the precursor with the metal containing aluminum by a molten metal forging method to prepare an aluminum-diamond-based composite having a flat plate shape comprising a surface layer containing 80% by volume or more of a metal containing aluminum on all the side surfaces of the composite.

13. The method according to claim 12, wherein the diamond powder has a frequency distribution of a particle size on volume basis in which a first peak is at a particle diameter of from 5 to 25 μ

m and a second peak is at a particle diameter of from 55 to 195 μ

m; and

wherein the diamond powder has a ratio of an area (A₁) of a particle size of from 1 to 35 μ

m to an area (A₂) of a particle size of from 45 to 205 μ

m of A₁;

A₂=from 1;

9 to 4;

6.

14. The method according to claim 12, wherein the step 3) comprises placing the aluminum-containing material on both the top and bottom surfaces of the layer of the diamond powder such that the surface layer having a thickness of 0.02 mm or more is formed on both the top and bottom surfaces.

15. The method according to claim 12, wherein the method comprises performing, between the step 3) and the step 4), a step 3′

) of cutting and processing the precursor in a thickness direction such that the precursor has a size smaller than a target flat dimension of the flat plate shape by 0.02 to 0.2 mm, and wherein the step

     4) comprises placing the aluminum-containing material on all the side surfaces of the precursor such that the surface layer having an average thickness of 0.02 mm or more is formed on all the side surfaces.

16. The method according to claim 12, wherein the method comprises a step 5 of grinding the surface layer of the overall surface after the step 4).

17. The method according to claim 15, wherein the step 3) comprises placing the aluminum-containing material on both the top and bottom surfaces of the layer of the diamond powder such that the surface layer having a thickness of 0.2 mm or more is formed on both the top and bottom surfaces, and the step 3′

) is carried out such that a dimensional error is more than ±

0.050 mm and ±

0.100 mm or less, and wherein the step

     5) is carried out such that a dimensional error is ±

0.020 mm or less.