Magnetic Phase Change Material for Heat Dissipation
First Claim
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1. An electronic component, comprising:
- an electronic chip; and
a magnetic phase change material thermally coupled with the electronic chip and configured to consume energy when changing between different magnetic phases in response to heating up to or above a phase change temperature and thereby dissipate heat from the electronic chip upon heating up to or above the phase change temperature.
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Abstract
An electronic component includes an electronic chip and a magnetic phase change material configured to consume energy when changing between different magnetic phases in response to heating above a phase change temperature. The phase change material is thermally coupled with the electronic chip to thereby dissipate heat from the electronic chip upon heating up to or above the phase change temperature.
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Citations
24 Claims
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1. An electronic component, comprising:
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an electronic chip; and a magnetic phase change material thermally coupled with the electronic chip and configured to consume energy when changing between different magnetic phases in response to heating up to or above a phase change temperature and thereby dissipate heat from the electronic chip upon heating up to or above the phase change temperature. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22)
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23. A method, comprising:
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providing an electronic chip thermally coupled with a magnetic phase change material which is configured to consume energy when changing between different magnetic phases in response to heating up to or above a phase change temperature; and operating the electronic chip and thereby generating heat which heats the phase change material up to or above the phase change temperature to thereby dissipate heat from the electronic chip by the phase change. - View Dependent Claims (24)
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Specification