POWER AMPLIFIERS WITH INJECTION-LOCKED OSCILLATOR
First Claim
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1. A packaged module comprising:
- a package substrate;
a semiconductor die attached to the package substrate, the semiconductor die including a power amplifier having two or more stages electrically coupled between an input and an output, the two or more stages including an injection-locked oscillator stage configured to receive a radio frequency input signal and to generate an injection-locked radio frequency signal; and
an output matching network attached to the package substrate, the output matching network configured to provide output impedance matching to the output of the power amplifier.
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Abstract
Power amplifiers with injection-locked oscillator are provided. In certain configurations, a packaged module includes a package substrate, a semiconductor die attached to the package substrate and having a power amplifier formed thereon, and an output matching network attached to the package substrate and operable to provide output impedance matching to an output of the power amplifier. The power amplifier includes two or more stages electrically coupled between the input and an output, and the two or more stages include an injection-locked oscillator stage that receives a radio frequency input signal and generates an injection-locked radio frequency signal.
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Citations
20 Claims
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1. A packaged module comprising:
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a package substrate; a semiconductor die attached to the package substrate, the semiconductor die including a power amplifier having two or more stages electrically coupled between an input and an output, the two or more stages including an injection-locked oscillator stage configured to receive a radio frequency input signal and to generate an injection-locked radio frequency signal; and an output matching network attached to the package substrate, the output matching network configured to provide output impedance matching to the output of the power amplifier. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A phone board assembly for a wireless device, the phone board assembly comprising:
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a phone board; a packaged module attached to the phone board and including a semiconductor die therein, the semiconductor die including a power amplifier having two or more stages electrically coupled between an input and an output, the two or more stages including an injection-locked oscillator stage configured to receive a radio frequency input signal and to generate an injection-locked radio frequency signal; and an output matching network attached to the phone board, the output matching network configured to provide output impedance matching to the output of the power amplifier. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18)
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19. A method of radio frequency amplification, the method comprising:
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receiving a radio frequency signal at an input of a multi-stage power amplifier, the multi-stage power amplifier formed on a semiconductor die that is attached to a package substrate; generating an injection-locked radio frequency signal from the radio frequency input signal using an injection-locked oscillator stage of the multi-stage power amplifier; and providing output impedance matching to an output of the multi-stage amplifier using an output matching network that is attached to the package substrate. - View Dependent Claims (20)
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Specification