SEMICONDUCTOR PACKAGE DEVICE

• US 20190107897A1
• Filed: 10/05/2017
• Published: 04/11/2019
• Est. Priority Date: 10/05/2017
• Status: Active Grant

• Current Assignee: Advanced Semiconductor Engineering Inc (ASE Technology Holding Co., Ltd.)
• Original Assignee: Advanced Semiconductor Engineering Inc (ASE Technology Holding Co., Ltd.)
• Inventors: OU, Jen-Kai, WANG, Meng-Jen, TSAI, Tsung-Yueh, HUNG, Chih-Ming
• Granted Patent: US 10,545,581 B2
• Time in Patent Office: Days
• CPC Class Codes: G06F 3/016 Input arrangements with force or tactile feedback as computer generated output to the user
• CPC Class Codes: G06F 3/0202 Constructional details or processes of manufacture of the input device
• CPC Class Codes: H10N 30/02 Forming enclosures or casings
• CPC Class Codes: H10N 30/03 Assembling devices that include piezoelectric or electrostrictive parts
• CPC Class Codes: H10N 30/063 Forming interconnections, e.g. connection electrodes of multilayered piezoelectric or electrostrictive parts
• CPC Class Codes: H10N 30/079 using intermediate layers, e.g. for growth control
• CPC Class Codes: H10N 30/302 Sensors
• CPC Class Codes: H10N 30/88 Mounts; Supports; Enclosures; Casings

Abstract

An electronic device includes a piezoelectric module, a sensing module and a buffer element. The piezoelectric module includes a substrate and a piezoelectric element. The substrate defines an opening penetrating the substrate. The piezoelectric element is disposed on the substrate and across the opening of the substrate. The sensing module is disposed over the piezoelectric module. The buffer element is disposed between the piezoelectric module and the sensing module.

Claims

1. An electronic device, comprising:

a piezoelectric module comprising;

a substrate defining an opening penetrating the substrate; and

a piezoelectric element disposed on the substrate and across the opening of the substrate;

a sensing module disposed over the piezoelectric module; and

a buffer element disposed between the piezoelectric module and the sensing module.

2. The electronic device of claim 1, wherein the buffer element comprises a conductive adhesive, a polymer core and a metal layer covering the polymer core, or an anisotropic conductive film (ACF).

3. The electronic device of claim 1, wherein the substrate comprises a plane portion and a dam structure, the dam structure disposed between the buffer element and the plane portion, wherein the sensing module, the dam structure and the buffer element define a space to accommodate the piezoelectric element.

4. The electronic device of claim 3, wherein a Young'"'"'s modulus of the dam structure is greater than a Young'"'"'s modulus of the buffer element.

5. The electronic device of claim 3, wherein the dam structure and the plane portion are integrally formed.

6. The electronic device of claim 3, wherein the dam structure comprises a printed circuit board.

7. The electronic device of claim 1, further comprising a conductive material disposed between the sensing module and the piezoelectric module to electrically connect the sensing module with the piezoelectric element.

8. The electronic device of claim 1, wherein the sensing module further comprises:

a carrier;

a die disposed on the carrier, the die comprising a light emitter or a light detector; and

a package body disposed on the carrier to cover the die.

9. The electronic device of claim 1, further comprising a flexible circuit board electrically connecting the sensing module to the substrate.

10. An electronic device, comprising:

a piezoelectric module comprising;

a substrate; and

a piezoelectric element disposed on the substrate;

a sensing module disposed over the piezoelectric module; and

a connection element disposed between the piezoelectric module and the sensing module,

wherein the sensing module is configured to move in a direction toward the piezoelectric element to deform the piezoelectric element.

11. The electronic device of claim 10, wherein the substrate defines an opening penetrating the substrate to define a space to accommodate a deformation of the piezoelectric element.

12. The electronic device of claim 10, wherein the connection element comprises an elastic material.

13. The electronic device of claim 10, wherein the connection element comprises a conductive adhesive, a polymer core and a metal layer covering the polymer core, or an ACF.

14. The electronic device of claim 10, wherein the sensing module is spaced apart from the piezoelectric element to provide for a movement of the sensing module.

15. The electronic device of claim 10, wherein the substrate comprises a plane portion and a dam structure disposed between the connection element and the plane portion, wherein the sensing module, the dam structure and the connection element define a space to accommodate the piezoelectric element.

16. The electronic device of claim 15, wherein the dam structure and the plane portion are integrally formed.

17. The electronic device of claim 15, wherein the dam structure comprises a printed circuit board.

18. The electronic device of claim 10, further comprising a flexible circuit board electrically connecting the sensing module with the substrate.

19. An electronic device, comprising:

a piezoelectric module comprising;

a substrate; and

a piezoelectric element disposed on the substrate;

a sensing module disposed over the piezoelectric module; and

a connection element disposed between the piezoelectric module and the sensing module, wherein the connection element electrically connects the sensing module with the substrate of the piezoelectric module.

20. The electronic device of claim 19, wherein the substrate defines an opening penetrating the substrate, and wherein the piezoelectric element is disposed across the opening of the substrate.

21. The electronic device of claim 19, wherein the substrate comprises a dam structure, and the connection element comprises a conductive buffer layer disposed over the conductive dam structure.

22. The electronic device of claim 21, wherein the dam structure comprises a printed circuit board.

23. The electronic device of claim 19, wherein the connection element comprises a conductive adhesive, a polymer core and a metal layer covering the polymer core, or an ACF tape.

24. The electronic device of claim 19, wherein the piezoelectric element is electrically connected to the sensing module and to the substrate of the piezoelectric module.