MICROELECTROMECHANICAL SYSTEM (MEMS) DEVICES
First Claim
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1. A microelectromechanical systems (MEMS) device comprising:
- a number of silicon dies overmolded with an overmold material;
a number of active areas formed on the silicon dies, the active areas comprising at least one sensor to sense a number of attributes of a fluid introduced to the at least one sensor; and
a fan-out layer coupled to the silicon dies, the fan-out layer comprising a number of fluid channels formed therein that interface with the active areas of the silicon dies and allow the fluid to flow to the at least one sensor.
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Abstract
One example provides a microelectromechanical systems (MEMS) device that includes a number of silicon die over-molded with an overmold material, a number of active areas formed on the silicon die, the active areas including at least one sensor to sense a number of attributes of a fluid introduced to the at least one sensor, and a fan-out layer coupled to the silicon die, the fan-out layer including a number of fluid channels formed therein that interface with active areas of the silicon die and allow the fluid to flow to the at least one sensor.
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Citations
15 Claims
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1. A microelectromechanical systems (MEMS) device comprising:
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a number of silicon dies overmolded with an overmold material; a number of active areas formed on the silicon dies, the active areas comprising at least one sensor to sense a number of attributes of a fluid introduced to the at least one sensor; and a fan-out layer coupled to the silicon dies, the fan-out layer comprising a number of fluid channels formed therein that interface with the active areas of the silicon dies and allow the fluid to flow to the at least one sensor. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A method of forming a microelectromechanical systems (MEMS) device comprising:
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overmolding a number of dies with an overmold material to form a coplanar package, the dies comprising a number of electrically active devices; and forming a fan-out layer on the coplanar package to increase distances between a number of features of the dies, the fan-out layer comprising a number of fluid channels formed therein that interface with the electrically active devices of the dies and cause a fluid to flow to the electrically active devices. - View Dependent Claims (8, 9, 10, 11)
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12. A lab-on-chip system comprising:
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a plurality of silicon dies; a number of electrically active devices disposed on a first side of the silicon dies; an overmold material overmolded over all sides of the silicon dies other than the first side; a fan-out layer coupled to each of the silicon dies, the fan-out layer comprising a number of fluid channels formed therein that interface with the electrically active devices; and an electrical redistribution layer (RDL) positioned between the fan-out layer and the silicon dies to electrically couple the electrically active devices to an external circuit. - View Dependent Claims (13, 14, 15)
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Specification