MOBILE TERMINAL

• US 20190121407A1
• Filed: 04/06/2018
• Published: 04/25/2019
• Est. Priority Date: 10/20/2017
• Status: Active Grant

• Current Assignee: LG Electronics, Inc. (LG Corporation)
• Original Assignee: LG Electronics, Inc. (LG Corporation)
• Inventors: LEE, Joseph, KIM, Sanghoon, PARK, Kyungui, PARK, Chansin, LEE, Jaewoong, JANG, Sukwon
• Granted Patent: US 10,642,323 B2
• Time in Patent Office: Days
• CPC Class Codes: G06F 1/1626 with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
• CPC Class Codes: G06F 1/1658 related to the mounting of internal components, e.g. disc drive or any other functional module
• CPC Class Codes: G06F 1/183 Internal mounting support structures, e.g. for printed circuit boards, internal connecting means for buses G06F13/409
• CPC Class Codes: G06F 1/203 for portable computers, e.g. for laptops
• CPC Class Codes: G06F 2200/201 Cooling arrangements using cooling fluid
• CPC Class Codes: H01L 23/44 the complete device being wholly immersed in a fluid other than air H01L23/427 takes precedence
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence

Abstract

A mobile terminal includes: a terminal body; a circuit board installed in the terminal body; an electronic device mounted to at least one surface of the circuit board; a shield can installed on the circuit board so as to cover the electronic device, and configured to shield electromagnetic waves generated from the electronic device; and a cooling fluid filled in an inner space defined by the circuit board and the shield can, and configured to cool the electronic device.

Claims

1. A mobile terminal, comprising:

a terminal body;

a circuit board installed in the terminal body;

an electronic device mounted to at least one surface of the circuit board;

a shield can installed on the circuit board so as to cover the electronic device, and configured to shield electromagnetic waves generated from the electronic device; and

a cooling fluid filled in an inner space defined by the circuit board and the shield can, and configured to cool the electronic device.

2. The mobile terminal of claim 1, wherein the shield can includes a base portion installed on the circuit board, and configured to accommodate the electronic device therein, and

wherein a fluid introduction hole is penetratingly-formed at one side of the base portion such that the cooling fluid is filled in the inner space.

3. The mobile terminal of claim 2, wherein a shielding member fitted into the fluid introduction hole and configured to prevent leakage of the cooling fluid filled in the inner space is installed at the base portion.

4. The mobile terminal of claim 1, wherein the cooling fluid is formed as at least two materials having different densities are mixed with each other.

5. The mobile terminal of claim 4, wherein the cooling fluid includes a material composed of water, air, FC-72 and an oil component.

6. The mobile terminal of claim 5, wherein the cooling fluid includes air, and

wherein a protrusion member disposed near the electronic device and extended from the circuit board by a thickness of the electronic device is installed at the circuit board, and the protrusion member restricts a contact between the air and the electronic device.

7. The mobile terminal of claim 2, wherein concavo-convexed portions configured to increase a contact area such that heat formed in the shield can is radiated, are formed on an upper surface or a lower surface of the base portion.

8. The mobile terminal of claim 2, wherein protruding portions configured to increase a contact area such that heat formed in the shield can is radiated, are formed on an upper surface or a lower surface of the base portion.

9. The mobile terminal of claim 2, wherein dimples configured to increase a contact area such that heat formed in the shield can is radiated, are formed on an upper surface or a lower surface of the base portion.

10. The mobile terminal of claim 1, wherein the shield can is installed to cover the electronic devices installed on an upper surface and a lower surface of the circuit board, and

wherein the cooling fluid is accommodated in the inner space defined by the circuit board and the shield can.

11. The mobile terminal of claim 10, wherein a through hole for movement of the cooling fluid is formed at the circuit board, and

wherein the inner spaces formed by the respective shield cans are communicated with each other by the through hole.

12. The mobile terminal of claim 1, wherein a waterproofing coating layer is formed on a surface of the circuit board, in order to restrict the cooling fluid accommodated in the shield can from being absorbed to the circuit board.

13. The mobile terminal of claim 1, further comprising:

a temperature sensor installed at the circuit board, and configured to sense a temperature;

a haptic module installed on the circuit board, and configured to generate a preset vibration pattern; and

a controller configured to compare the temperature sensed by the temperature sensor with a preset temperature, and to drive the haptic module when the sensed temperature is more than the preset temperature.

14. The mobile terminal of claim 13, further comprising a display unit configured to output video information by being connected to the circuit board, and

wherein when the sensed temperature is more than the preset temperature, the controller converts a direction of the video information.

15. The mobile terminal of claim 14, wherein when the sensed temperature is more than the preset temperature, the controller outputs, to the display unit, a warning message indicating a sensing of an abnormal temperature.

16. A mobile terminal, comprising:

a terminal body;

a first circuit board installed in the terminal body;

an electronic device installed on one surface of the first circuit board;

a shield can installed on the first circuit board so as to cover the electronic device, and configured to shield electromagnetic waves generated from the electronic device;

a second circuit board disposed above the shield can;

a communication module installed on the second circuit board; and

a cooling fluid filled in an inner space defined by the first circuit board and the shield can, and configured to cool the electronic device.

17. The mobile terminal of claim 16, wherein the shield can includes a base portion installed on the circuit board, and configured to accommodate the electronic device therein, and

wherein a fluid introduction hole is penetratingly-formed at one side of the base portion such that the cooling fluid is filled in the inner space.

18. The mobile terminal of claim 17, wherein a shielding member fitted into the fluid introduction hole and configured to prevent leakage of the cooling fluid filled in the inner space is installed at the base portion.

19. The mobile terminal of claim 16, wherein the cooling fluid is formed as at least two materials having different densities are mixed with each other.

20. The mobile terminal of claim 19, wherein the cooling fluid includes air, and

wherein a protrusion member disposed near the electronic device and extended from the circuit board by a thickness of the electronic device is installed at the circuit board, and the protrusion member restricts a contact between the air and the electronic device.