FAN-OUT SEMICONDUCTOR PACKAGE
First Claim
Patent Images
1. A fan-out semiconductor package comprising:
- a semiconductor chip having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface;
a heat dissipation member attached to the inactive surface of the semiconductor chip;
an encapsulant covering at least portions of each of the semiconductor chip and the heat dissipation member; and
a connection member disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pads,wherein the heat dissipation member has a thickness greater than that of the semiconductor chip.
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Abstract
A fan-out semiconductor package includes a semiconductor chip having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface, a heat dissipation member attached to the inactive surface of the semiconductor chip, an encapsulant covering at least portions of each of the semiconductor chip and the heat dissipation member, and a connection member disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pads. The heat dissipation member has a thickness greater than that of the semiconductor chip.
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Citations
30 Claims
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1. A fan-out semiconductor package comprising:
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a semiconductor chip having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; a heat dissipation member attached to the inactive surface of the semiconductor chip; an encapsulant covering at least portions of each of the semiconductor chip and the heat dissipation member; and a connection member disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pads, wherein the heat dissipation member has a thickness greater than that of the semiconductor chip. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. A fan-out semiconductor package, comprising:
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a semiconductor chip; a heat-dissipating member having a thickness greater than that of the semiconductor chip disposed on an inactive surface of the semiconductor chip; a connection member comprising a redistribution layer, the connection member being disposed on an active layer of the semiconductor chip such that connection pads disposed on the active layer are electrically connected to the redistribution layer, wherein at least portions of each of the semiconductor chip and the heat dissipation member are covered by an encapsulant. - View Dependent Claims (22, 23, 24, 25, 26)
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27. A fan-out semiconductor package comprising:
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a connection member comprising at least one redistribution layer; a semiconductor chip having connection pads provided on an active surface thereof disposed on the connection member, the connection pads being electrically connected to the redistribution layer; a heat dissipation member having a thickness greater than that of the semiconductor chip disposed on an inactive surface of the semiconductor chip, the inactive surface being opposite the active surface; and an encapsulant covering at least portions of each of the semiconductor chip and the heat dissipation member. - View Dependent Claims (28, 29, 30)
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Specification