×

MULTI-WAFER BASED LIGHT ABSORPTION APPARATUS AND APPLICATIONS THEREOF

  • US 20190140133A1
  • Filed: 12/13/2018
  • Published: 05/09/2019
  • Est. Priority Date: 07/24/2015
  • Status: Active Grant
First Claim
Patent Images

1. A method for fabricating a photodetector using a plurality of wafers, the method comprising:

  • forming, over a first wafer, a first layer including one or more of;

    a germanium-based layer, or an aluminum-based layer;

    forming, over a second wafer, a second layer including one or more of;

    a germanium-based layer, or an aluminum-based layer,wherein the formed first and second layers include at least one germanium-based layer and one aluminum-based layer; and

    performing a wafer bonding process to bond together the first and second wafers, with the formed layers facing each other, wherein at least a portion of the formed layers becomes an aluminum-germanium eutectic alloy that bonds the first and second wafers together;

    wherein at least one of said forming steps includes performing one or more pre-bonding processes to its respective layer such that, after said pre-bonding processes, the aluminum-germanium eutectic alloy formed during the wafer bonding process has a lower eutectic temperature than without said pre-bonding processes.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×