SEMICONDUCTOR DEVICE
First Claim
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1. A semiconductor device comprising:
- a base plate bonded to a case by means of a bonding agent, whereinthe base plate includes a heat dissipation metal plate having a heat dissipation property, and a resin insulating layer structured by resin,the resin insulating layer is formed on the heat dissipation metal plate,the resin insulating layer is provided with a notch where part of the heat dissipation metal plate is exposed, andthe case is bonded, by means of the bonding agent, to an exposure part being part of the heat dissipation metal plate and exposed by the notch.
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Abstract
A base plate includes a heat dissipation metal plate and a resin insulating layer. The resin insulating layer is formed on the heat dissipation metal plate. The resin insulating layer is provided with a notch where part of the heat dissipation metal plate is exposed. A case is bonded to an exposure part being part of the heat dissipation metal plate by means of a bonding agent.
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Citations
10 Claims
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1. A semiconductor device comprising:
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a base plate bonded to a case by means of a bonding agent, wherein the base plate includes a heat dissipation metal plate having a heat dissipation property, and a resin insulating layer structured by resin, the resin insulating layer is formed on the heat dissipation metal plate, the resin insulating layer is provided with a notch where part of the heat dissipation metal plate is exposed, and the case is bonded, by means of the bonding agent, to an exposure part being part of the heat dissipation metal plate and exposed by the notch. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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Specification