LIGHT EMITTING DIODE HEAT SINK

• US 20190159290A1
• Filed: 01/28/2019
• Published: 05/23/2019
• Est. Priority Date: 09/30/2016
• Status: Active Grant

• Current Assignee: Hp Scitex Ltd. (HP Inc.)
• Original Assignee: Hp Scitex Ltd. (HP Inc.)
• Inventors: Veis, Alex
• Granted Patent: US 10,448,459 B2
• Time in Patent Office: Days
• CPC Class Codes: B41J 11/0021 using irradiation
• CPC Class Codes: B41J 11/00214 using UV radiation
• CPC Class Codes: B41J 11/00216 using infrared [IR] radiation or microwaves
• CPC Class Codes: F27D 11/12 with electromagnetic fields acting directly on the material being heated
• CPC Class Codes: H05B 3/0033 Heating devices using lamps
• CPC Class Codes: H05B 3/0066 for photocopying
• CPC Class Codes: H05B 3/009 heating devices not specially adapted for a particular application
• CPC Class Codes: H05K 7/20254 Cold plates transferring heat from heat source to coolant

Abstract

In some examples, a heating apparatus includes a light emitting diode (LED) array comprising an LED to heat a target object, and a heat sink thermally coupled to the LED array, to dissipate heat from the LED array, the heat sink comprising a plurality of refrigerant paths to pass a refrigerant through the heat sink in a plurality of different directions.

Claims

1. A heating apparatus comprising:

a light emitting diode (LED) array comprising an LED to heat a target object; and

a heat sink thermally coupled to the LED array, to dissipate heat from the LED array, the heat sink comprising a plurality of refrigerant paths to pass a refrigerant through the heat sink in a plurality of different directions.

2. The heating apparatus of claim 1, wherein a refrigerant path of the plurality of refrigerant paths comprises a through hole formed in the heat sink.

3. The heating apparatus of claim 1, wherein a refrigerant path of the plurality of refrigerant paths comprises a channel formed in a surface of the heat sink.

4. The heating apparatus of claim 1, wherein a refrigerant path of the plurality of refrigerant paths comprises a conduit that extends from outside the heat sink to an inner portion of the heat sink.

5. The heating apparatus of claim 1, wherein a refrigerant path of the plurality of refrigerant paths is curved within the heat sink.

6. The heating apparatus of claim 1, wherein a refrigerant path of the plurality of refrigerant paths extends in a zig-zag manner within the heat sink.

7. The heating apparatus of claim 1, wherein the plurality of refrigerant paths extends in a serpentine manner within the heat sink.

8. The heating apparatus of claim 1, wherein the plurality of refrigerant paths comprises a continuous through hole extending within the heat sink in the serpentine manner.

9. The heating apparatus of claim 1, wherein the plurality of refrigerant paths comprises a continuous conduit extending within the heat sink in the serpentine manner.

10. The heating apparatus of claim 1, wherein the LED array is attached to the heat sink through a thermally conductive layer.

11. A system comprising:

a light emitting diode (LED) array comprising an LED to heat a target object;

a heat sink thermally coupled to the LED array, the heat sink comprising a plurality of refrigerant paths to pass a refrigerant through the heat sink in a plurality of different directions; and

a refrigeration system configured to;

cool the refrigerant within the refrigeration system, and

pass the cooled refrigerant through the plurality of refrigerant paths such that heat from the LED array is transferred to the cooled refrigerant via the heat sink.

12. The system of claim 11, further comprising:

a conduit connected between the refrigeration system and a refrigerant path of the plurality of refrigerant paths.

13. The system of claim 12, wherein the conduit extends into the heat sink and forms the refrigerant path of the plurality of refrigerant paths.

14. The system of claim 11, wherein a refrigerant path of the plurality of refrigerant paths comprises a through hole formed in the heat sink.

15. The system of claim 11, wherein a refrigerant path of the plurality of refrigerant paths comprises a channel formed in a surface of the heat sink.

16. The system of claim 11, wherein a refrigerant path of the plurality of refrigerant paths is curved within the heat sink.

17. The system of claim 11, wherein a refrigerant path of the plurality of refrigerant paths extends in a zig-zag manner within the heat sink.

18. The system of claim 11, wherein the plurality of refrigerant paths extends in a serpentine manner within the heat sink.

19. The system of claim 18, wherein the plurality of refrigerant paths comprises a continuous through hole extending within the heat sink in the serpentine manner.

20. The system of claim 18, wherein the plurality of refrigerant paths comprises a continuous conduit extending within the heat sink in the serpentine manner.