Residue-Free Metal Gate Cutting For Fin-Like Field Effect Transistor
First Claim
1. A method comprising:
- receiving an integrated circuit (IC) device structure that includes;
a substrate;
one or more fins disposed over the substrate;
a plurality of gate structures disposed over the one or more fins, wherein the plurality of gate structures traverses the one or more fins and includes first and second gate structures;
a dielectric layer disposed between and adjacent to the plurality of gate structures; and
a patterning layer disposed over the plurality of gate structures and the dielectric layer;
creating an opening in the patterning layer to expose a portion of the first gate structure, a portion of the second gate structure, and a portion of the dielectric layer between and adjacent to the first and second gate structures; and
removing the exposed portion of the first gate structure, the exposed portion of the second gate structure, and the exposed portion of the dielectric layer.
1 Assignment
0 Petitions
Accused Products
Abstract
Metal gate cutting techniques for fin-like field effect transistors (FinFETs) are disclosed herein. An exemplary method includes receiving an integrated circuit (IC) device structure that includes a substrate, one or more fins disposed over the substrate, a plurality of gate structures disposed over the fins, a dielectric layer disposed between and adjacent to the gate structures, and a patterning layer disposed over the gate structures. The gate structures traverses the fins and includes first and second gate structures. The method further includes: forming an opening in the patterning layer to expose a portion of the first gate structure, a portion of the second gate structure, and a portion of the dielectric layer; and removing the exposed portion of the first gate structure, the exposed portion of the second gate structure, and the exposed portion of the dielectric layer.
14 Citations
20 Claims
-
1. A method comprising:
-
receiving an integrated circuit (IC) device structure that includes; a substrate; one or more fins disposed over the substrate; a plurality of gate structures disposed over the one or more fins, wherein the plurality of gate structures traverses the one or more fins and includes first and second gate structures; a dielectric layer disposed between and adjacent to the plurality of gate structures; and a patterning layer disposed over the plurality of gate structures and the dielectric layer; creating an opening in the patterning layer to expose a portion of the first gate structure, a portion of the second gate structure, and a portion of the dielectric layer between and adjacent to the first and second gate structures; and removing the exposed portion of the first gate structure, the exposed portion of the second gate structure, and the exposed portion of the dielectric layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
-
-
11. A method comprising:
-
forming a plurality of fins over a substrate and extending along a first direction; forming an inter-layer dielectric (ILD) layer over the plurality of fins; forming a first metal gate structure and a second metal gate structure over the plurality of fins and extending along a second direction that is substantially perpendicular to the first direction; forming a patterning layer over the first and second metal gate structures and the ILD layer; defining a cut window in the patterning layer for cutting the first and second metal gate structures, wherein the cut window exposes a portion of the first metal gate structure, a portion of the second metal gate structure, and a portion of the ILD layer between and adjacent to the first and second metal gate structures; and simultaneously etching the exposed portion of the first metal gate structure, the exposed portion of the second metal gate structure, and the exposed portion of the ILD layer. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18)
-
-
19. An integrated circuit (IC) device comprising:
-
a substrate; a first fin and a second fin disposed over the substrate and extending along a first direction; a first metal gate structure and a second metal gate structure disposed over the first and second fins and extending along a second direction that is substantially perpendicular to the first direction, wherein, for a portion of a distance between the first and second fins in the second direction, a distance between the first and second metal gate structures in the first direction is dividable into three contiguous sections including a first section, a second section, and a third section; a first inter-layer dielectric (ILD) layer disposed in the first and third sections; and a second ILD layer disposed in the second section such that the second section does not contain any portion of the first ILD layer, any portion of the first metal gate structure, or any portion of the second metal gate structure. - View Dependent Claims (20)
-
Specification