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MICROELECTRONICS PACKAGE WITH AN INTEGRATED HEAT SPREADER

  • US 20190198416A1
  • Filed: 12/27/2017
  • Published: 06/27/2019
  • Est. Priority Date: 12/27/2017
  • Status: Active Grant
First Claim
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1. A microelectronics package comprising:

  • a first die;

    a second die;

    a third die; and

    an integrated heat spreader, the integrated heat spreader including a first surface, the first surface defining;

    a first indentation located in between the first die and the second die, anda second indentation located in between the third die and the first die and the second die.

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