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SEMICONDUCTOR DEVICE

  • US 20190198463A1
  • Filed: 11/15/2018
  • Published: 06/27/2019
  • Est. Priority Date: 12/25/2017
  • Status: Active Grant
First Claim
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1. A semiconductor device, comprising:

  • a semiconductor chip including a first surface, a second surface opposite to the first surface, a first side, a second side opposite the first side, a first electrode formed on the first surface and a second electrode formed on the first surface; and

    a wiring substrate including a first main surface over which the semiconductor chip is mounted, a second main surface opposite to the first main surface, a first wire for output signals extending in a first direction along the first main surface and located between the first and second main surface, a second wire for input signals extending in the first direction and located closer to the main surface than the first wire in a cross-section view,wherein the first wire is electrically connected with the first electrode of the semiconductor chip,wherein the second wire is electrically connected with the second electrode of the semiconductor chip and is located between a first conductor pattern and a second conductor in a cross-section view, andwherein, when a wire cross-sectional area is defined as the cross-sectional area of each of the first and second wires in a second direction orthogonal to the first direction, the wire cross-sectional area of the second wire is smaller than the wire cross-sectional area of the first wire.

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