THREE DIMENSIONAL INDUCTOR-CAPACITOR APPARATUS AND METHOD OF FABRICATING
First Claim
1. An apparatus comprising:
- a plurality of stacked metal layers, including;
a first metal layer including a first inductor, the first inductor configured in a spiral shape;
a second metal layer including a plurality of first pads and a plurality of second pads;
a third metal layer including a plurality of third pads and a plurality of fourth pads;
a fourth metal layer including a second inductor, the second inductor configured in a spiral shape;
a plurality of first vias configured to couple the first metal layer to the second metal layer;
a plurality of second vias configured to couple the second metal layer to the third metal layer;
a plurality of third vias configured to couple the third metal layer to the fourth metal layer; and
a dielectric layer at least partially surrounding the apparatus.
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Accused Products
Abstract
Some aspects pertain to an apparatus that includes a plurality of stacked metal layers configured in a spiral shape. The plurality of stacked metal layers include a first metal layer including a first inductor, a second metal layer including a plurality of first pads and a plurality of second pads, a third metal layer including a plurality of third pads and a plurality of fourth pads, a fourth metal layer including a second inductor, a plurality of first vias configured to couple the first metal layer to the second metal layer, a plurality of second vias configured to couple the second metal layer to the third metal layer, a plurality of third vias configured to couple the third metal layer to the fourth metal layer; and a dielectric layer at least partially surrounding the apparatus.
16 Citations
26 Claims
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1. An apparatus comprising:
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a plurality of stacked metal layers, including; a first metal layer including a first inductor, the first inductor configured in a spiral shape; a second metal layer including a plurality of first pads and a plurality of second pads; a third metal layer including a plurality of third pads and a plurality of fourth pads; a fourth metal layer including a second inductor, the second inductor configured in a spiral shape; a plurality of first vias configured to couple the first metal layer to the second metal layer; a plurality of second vias configured to couple the second metal layer to the third metal layer; a plurality of third vias configured to couple the third metal layer to the fourth metal layer; and a dielectric layer at least partially surrounding the apparatus. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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19. A method of fabricating an apparatus comprising:
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forming a plurality of stacked metal layers, including; forming a first metal layer including forming a first inductor in a spiral shape; forming a second metal layer including forming a plurality of first pads and a plurality of second pads; forming a third metal layer including forming a plurality of third pads and a plurality of fourth pads; forming a fourth metal layer including forming a second inductor in a spiral shape; forming a plurality of first vias and coupling the first metal layer to the second metal layer; forming a plurality of second vias and coupling the second metal layer to the third metal layer; forming a plurality of third vias and coupling the third metal layer to the fourth metal layer; and forming a dielectric layer at least partially surrounding the apparatus. - View Dependent Claims (20, 21, 22, 23, 24, 25, 26)
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Specification