Multi-Layer, Multi-Material Micro-Scale and Millimeter-Scale Devices with Enhanced Electrical and/or Mechanical Properties

• US 20190212364A1
• Filed: 12/28/2018
• Published: 07/11/2019
• Est. Priority Date: 12/31/2003
• Status: Active Grant

• Current Assignee: University of Southern California
• Original Assignee: University of Southern California
• Inventors: Wu, Ming Ting, Larsen, III, Rulon J., Kim, Young, Kim, Kieun, Cohen, Adam L., Kumar, Ananda H., Lockard, Michael S., Smalley, Dennis R.
• Granted Patent: US 10,641,792 B2
• Time in Patent Office: Days
• CPC Class Codes: B32B 15/01 all layers being exclusively metallic making layered metal workpieces by pressure cladding B23K20/22; making coatings with a metallic material characterised by its composition C23C30/00
• CPC Class Codes: G01R 1/06761 related to layers
• CPC Class Codes: Y10T 428/12486 Laterally noncoextensive components [e.g., embedded, etc.]

Abstract

Some embodiments of the invention are directed to electrochemical fabrication methods for forming structures or devices (e.g. microprobes for use in die level testing of semiconductor devices) from a core material and a shell or coating material that partially coats the surface of the structure. Other embodiments are directed to electrochemical fabrication methods for producing structures or devices (e.g. microprobes) from a core material and a shell or coating material that completely coats the surface of each layer from which the probe is formed including interlayer regions. Additional embodiments of the invention are directed to electrochemical fabrication methods for forming structures or devices (e.g. microprobes) from a core material and a shell or coating material wherein the coating material is located around each layer of the structure without locating the coating material in inter-layer regions.

Claims

1. :

A compliant probe for providing an electrical connection between at least two electronic components, the probe comprising;

a) a first planarized layer comprising at least a first structural material and a second structural material located above at least a portion of the first structural material wherein at least the second structural material is planarized to set a boundary level for the first planarized layer;

b) a second planarized layer comprising at least a third structural material, wherein the third structural material is either directly adhered to a material selected from the group consisting of the first structural material of the first layer, the second structural material of the first layer, and a material of an intermediate layer that separates the first layer from the second layer;

wherein the second structural material of the first layer is different from both the first structural material of the first layer and the third structural material of the second layer, wherein the second structural material of the first layer has sides, and wherein at least a portion of the sides of the second structural material of the first planarized layer are bounded by the first structural material of the first layer, and

wherein upon use, the compliant probe is configured to provide an elastic electrical contact path between at least two electronic components.

2. :

The compliant probe of claim 1 wherein the first structural material of the first layer and third structural material of the second layer are the same material.

3. :

The compliant probe of claim 2 wherein at least one of the materials selected from the group consisting of (1) the first structural material, (2) the second structural material, and (3) the third structural material comprises a material selected from the group consisting of;

(1) nickel (Ni), (2) copper (Cu), (3) beryllium copper (BeCu), (4) nickel phosphor (Ni—

P), (5) tungsten (W), (6) aluminum copper (Al—

Cu), (7) steel, (8) P7 alloy, (9) palladium, (10) molybdenum, (11) manganese, (12) brass, (13) chrome, (14) chromium copper (Cr—

Cu), (15) gold (Au), (16) silver (AG), (17) nickel-cobalt (Ni—

Co), (18) palladium-cobalt (Pd—

Co), (19) tin (Sn), and (20) a combination of any two of these materials.

4. :

The compliant probe of claim 1 additionally comprising a contact tip material forming part of at least one layer.

5. :

The compliant probe of claim 4 wherein the contact tip material is different from another structural material forming part of the same layer.

6. :

The compliant probe of claim 5 wherein the layer comprising the contact tip also comprises a core material that is different from both the contact tip material and another structural material of the same layer.

8. :

The compliant probe of claim 5 wherein in the contact tip comprises rhodium.

9. :

The compliant probe of claim 1 wherein a compressive direction of the probe is perpendicular to a direction of stacking of the first and second planarized layers.

10. :

The compliant probe of claim 1 wherein a compressive direction of the probe is substantially parallel to a stacking direction of the first and second planarized layers.

11. :

The compliant probe of claim 1 wherein the first and third structural materials have a higher yield strength than the second structural material.

12. :

The compliant probe of claim 1 wherein the second structural material has a higher electrical conductive than the first and third structural materials.

13. :

The compliant probe of claim 1 wherein the second structural material is fully encapsulated by a different structural material.

14. :

The compliant probe of claim 1 wherein the first, second, and third structural materials are electrodeposited materials.

7. (canceled)

15. (canceled)

16. :

A compliant probe for providing an electrical connection between at least two electronic components, the probe comprising;

a) a first planarized layer comprising at least a first structural material;

b) a second planarized layer comprising at least a second structural material, wherein the second structural material of the second planarized layer has a relationship with the first planarized layer selected from the group consisting of;

(1) the second structural material of the second planarized layer is directly adhered to the first planarized layer, (2) the second structural material or the second planarized layer is separated from the first planarized layer by at least one intermediate layer, and (3) the second structural material of the second planarized layer is separated from the first planarized layer by at least one deposition of material;

c) a third planarized layer comprising at least a third structural material, wherein the third structural material of the third planarized layer has a relationship with the second planarized layer selected from the group consisting of;

(1) the third structural material of the third planarized layer is adhered directly to the second planarized layer, (2) the third structural material of the third planarized layer is separated from the second planarized layer by at least one intermediate layer, and (3) the third structural material of the third planarized layer is separated from the second planarized layer by at least one deposition of material,

wherein the second planarized layer is located between the first and third planarized layers, and

wherein the second structural material is different from both the first structural material and the third structural material, and

wherein the compliant probe is configured to provide a compliant electrical contact element that provides a conductive path between the at least two electronic components,

wherein each of at least one of the first to third planarized layers comprises at least one core structural material and at least one shell structural material, wherein one of the at least one core structural material and the at least one shell structural material of a respective layer corresponds to a respective first structural material, second structural material, or third structural material while another of the at least one shell structural material and at least one core structural material do not, and wherein the shell structural material of the respective layer surrounds a bottom and sides of at least selected volumes of the core structural material of the respective layer.

17. :

The compliant probe of claim 16 wherein the respective layer comprises the second planarized layer and at least one core structural material comprises the second structural material of the second planarized layer and at least one shell structural material of the second planarized layer comprises a different material.

18. :

The compliant probe of claim 17 wherein the first and third structural materials and the at least one shell structural material of the second planarized layer comprise the same material.

19. :

The compliant probe of claim 18 wherein at least one of the materials selected from the group consisting of (1) the first structural material, (2) the second structural material, and (3) the third structural material comprises a material selected from the group consisting of;

(1) nickel (Ni), (2) copper (Cu), (3) beryllium copper (BeCu), (4) nickel phosphor (Ni—

P), (5) tungsten (W), (6) aluminum copper (Al—

Cu), (7) steel, (8) P7 alloy, (9) palladium, (10) molybdenum, (11) manganese, (12) brass, (13) chrome, (14) chromium copper (Cr—

Cu), (15) gold (Au), (16) silver (AG), (17) nickel-cobalt (Ni—

Co), (18) palladium-cobalt (Pd—

Co), (19) tin (Sn), and (20) a combination of any two of these materials.

20. :

The compliant probe of claim 16 additionally comprising a contact tip material forming part of at least one layer wherein the contact tip material is a different metal than that of the at least one core structural material.

21. :

The compliant probe of claim 20 wherein the contact tip material of a layer is different from another structural material forming part of the same layer.

22. :

The compliant probe of claim 16 wherein at least two of the first, second, and third planarized layers comprise regions of core materials and shell materials.