Manufacturing method for light emitting device, light emitting device, and hybrid light emitting device

• US 20190214604A1
• Filed: 08/24/2017
• Published: 07/11/2019
• Est. Priority Date: 08/26/2016
• Status: Active Grant

• Current Assignee: Najing Technology Corporation Ltd.
• Original Assignee: Najing Technology Corporation Ltd.
• Inventors: ZHEN, Changgua, GU, Xinyan
• Granted Patent: US 10,943,781 B2
• Time in Patent Office: Days
• CPC Class Codes: H01L 21/02288 printing, e.g. ink-jet printing per se B41J
• CPC Class Codes: H01L 21/02296 characterised by the treatment performed before or after the formation of the layer H01L21/02227 and subgroups take precedence
• CPC Class Codes: H01L 21/4867 Applying pastes or inks, e.g. screen printing H01L21/486 takes precedence
• CPC Class Codes: H01L 31/035218 the quantum structure being quantum dots
• CPC Class Codes: H10K 50/115 comprising active inorganic nanostructures, e.g. luminescent quantum dots
• CPC Class Codes: H10K 50/15 Hole transporting layers
• CPC Class Codes: H10K 50/16 Electron transporting layers
• CPC Class Codes: H10K 50/17 Carrier injection layers
• CPC Class Codes: H10K 50/171 Electron injection layers
• CPC Class Codes: H10K 59/35 comprising red-green-blue [RGB] subpixels
• CPC Class Codes: H10K 71/00 Manufacture or treatment specially adapted for the organic devices covered by this subclass
• CPC Class Codes: H10K 71/12 using liquid deposition, e.g. spin coating
• CPC Class Codes: H10K 71/13 using printing techniques, e.g. ink-jet printing or screen printing
• CPC Class Codes: H10K 71/135 using ink-jet printing
• CPC Class Codes: H10K 71/191 characterised by provisions for the orientation or alignment of the layer to be deposited
• CPC Class Codes: H10K 71/40 Thermal treatment, e.g. annealing in the presence of a solvent vapour

Abstract

A manufacturing method for a light emitting device, a light emitting device, and a hybrid light emitting device, the manufacturing method comprises the following steps: step S1: disposing a mask plate having a plurality of hollow portions on a substrate; step S2: by using a solution method, applying ink on a surface of the substrate through the hollow portions; and step S3: drying or solidifying the ink on the surface of the substrate to form a light emitting layer or a functional layer.

Claims

1. A manufacturing method for a light emitting device, comprising the following steps:

step S1;

disposing a mask plate having a plurality of hollow portions on a substrate;

step S2;

by solution method, applying ink on a surface of the substrate through the hollow portions; and

step S3;

drying or solidifying the ink on the surface of the substrate to form a light emitting layer or a functional layer.

2. The manufacturing method as claimed in claim 1, wherein the ink is quantum dot material ink, the manufacturing method further comprises a process of at least one time of repeatedly performing the step S1 to the step S3, in each time of the repeated process, the hollow portions of the used mask plate correspond to different areas of the substrate, the light emitting colors of the used inks are different.

3. The manufacturing method as claimed in claim 1, wherein

the mask plate in the step S1 has a modified surface, the modified surface includes a surface of one side of the mask plate away from the substrate, the modified surface has hydrophilicity or hydrophobicity;

and

the ink used in the step S2 and the modified surface have different hydrophilicity-hydrophobicity.

4. The manufacturing method as claimed in claim 3, wherein the modified surface further comprises a surface of one side of the mask plate adjacent to the substrate.

5. The manufacturing method as claimed in claim 4,

wherein when the modified surface is a hydrophobic surface, the manufacturing method further comprises a process of forming the modified surface, the process of forming the modified surface includes the following steps:

step S01, immerging the mask plate in a solution with a hydrophobic material, so that the hydrophobic material is fixed on the surface of the mask plate, preferably the hydrophobic material is a fluoric silane coupling agent; and

step S02, separating the mask plate fixed with the hydrophobic material from the solution, and drying the mask plate, so as to form the modified surface with hydrophobicity.

6. The manufacturing method as claimed in claim 1, wherein the manufacturing method further comprises a process of pre-processing the mask plate, the pre-processing process comprises the following steps:

performing ultraviolet ozone photolysis oxidization on the surface of the mask plate, so that the hydrophilic surface of the mask plate is completely exposed.

7. The manufacturing method as claimed in claim 1, wherein

the substrate in the step S1 is provided with a pixel separating structure, and the pixel separating structure is provided with multiple mutually separated sub-pixel areas, and the hollow portions are disposed corresponding to each sub-pixel areas;

and

in the step S2, the ink enters the corresponding sub-pixel areas after passing through the hollow portions.

8. The manufacturing method as claimed in claim 1, wherein

the surface of the substrate in the step S1 has a plurality of hydrophilic areas and a plurality of hydrophobic areas, the hollow portions are disposed corresponding to the hydrophilic areas or the hydrophobic areas;

and

in the step S2, the hydrophobic ink enters the hydrophobic areas after passing through the hollow portions, or the hydrophilic ink enters the hydrophilic areas after passing through the hollow portions.

9. The manufacturing method as claimed in claim 1, wherein

the ink is any one of hole injection material ink, hole transporting material ink, electron injection material ink or electron transporting material ink, in the step S3, the ink is dried, so as to correspondingly form a hole injection layer, a hole transporting layer, an electron injection layer or an electron transporting layer;

or

the ink is quantum dot material ink or organic light emitting material ink, in the step S3, the ink is dried, so as to correspondingly form a quantum dot light emitting layer or an organic light emitting layer.

10. The manufacturing method as claimed in claim 1, wherein

the ink is electrode material ink, in the step S3, the ink is dried, so as to form a corresponding electrode layer.

11. The manufacturing method as claimed in claim 1, wherein

the ink is any one of hole injection material ink, hole transporting material ink, electron injection material ink, electrode material ink or electron transporting material ink, in the step S3, the ink is solidified, so as to correspondingly form a hole injection layer, a hole transporting layer, an electron injection layer, an electrode layer or an electron transporting layer;

or

the ink is quantum dot material ink or organic light emitting material ink, in the step S3, the ink is solidified, so as to correspondingly form a quantum dot light emitting layer or an organic light emitting layer.

12. The manufacturing method as claimed in claim 1, wherein

in the step S2, a spray-coating process or an inkjet printing process is used so that the ink is disposed on the surface of the substrate after passing through the hollow portions.

13. A light emitting device, wherein the light emitting device is prepared by the manufacturing method as claimed in claim 1, wherein the light emitting device is an electroluminescence device or a photoluminescence device.

14. A hybrid light emitting device, wherein the hybrid light emitting device comprise an electroluminescence device and a photoluminescence device disposed at the light emitting side of the electroluminescence device, wherein the electroluminescence device and/or the photoluminescence device is prepared according to the manufacturing method as claimed in claim 1.

15. The manufacturing method as claimed in claim 2, wherein

the mask plate in the step S1 has a modified surface, the modified surface includes a surface of one side of the mask plate away from the substrate, the modified surface has hydrophilicity or hydrophobicity;

and

the ink used in the step S2 and the modified surface have different hydrophilicity-hydrophobicity.

16. The manufacturing method as claimed in claim 2, wherein the manufacturing method further comprises a process of pre-processing the mask plate, the pre-processing process comprises the following steps:

performing ultraviolet ozone photolysis oxidization on the surface of the mask plate, so that the hydrophilic surface of the mask plate is completely exposed.

17. The manufacturing method as claimed in claim 2, wherein

the substrate in the step S1 is provided with a pixel separating structure, and the pixel separating structure is provided with multiple mutually separated sub-pixel areas, and the hollow portions are disposed corresponding to each sub-pixel areas;

and

in the step S2, the ink enters the corresponding sub-pixel areas after passing through the hollow portions.

18. The manufacturing method as claimed in claim 2, wherein

the surface of the substrate in the step S1 has a plurality of hydrophilic areas and a plurality of hydrophobic areas, the hollow portions are disposed corresponding to the hydrophilic areas or the hydrophobic areas;

and

in the step S2, the hydrophobic ink enters the hydrophobic areas after passing through the hollow portions, or the hydrophilic ink enters the hydrophilic areas after passing through the hollow portions.

19. The manufacturing method as claimed in claim 2, wherein

in the step S2, a spray-coating process or an inkjet printing process is used so that the ink is disposed on the surface of the substrate after passing through the hollow portions.

20. The manufacturing method as claimed in claim 1, wherein the spray-coating process is ultrasonic spray-coating.