Enclosure with Metal Interior Surface Layer
First Claim
Patent Images
1. An electronic device, comprising:
- a non-metal layer having a prepared surface;
a primer layer disposed on the prepared surface;
an electroless metal layer disposed on the primer layer; and
an electroplated metal layer formed on the electroless metal layer.
0 Assignments
0 Petitions
Accused Products
Abstract
An enclosure is formed by coupling an outer cover to a back enclosure piece. The enclosure defines an interior volume for receiving components of an electronic device. The back enclosure piece is formed from a metal frame component and a non-metal outer cover. A metal layer overlaps the metal frame component and the outer cover within the interior volume. The metal layer has a thickness that provides support and shatter resistance to the non-metal outer cover. The metal layer can form an inductor of a wireless power transfer circuit.
20 Citations
20 Claims
-
1. An electronic device, comprising:
-
a non-metal layer having a prepared surface; a primer layer disposed on the prepared surface; an electroless metal layer disposed on the primer layer; and an electroplated metal layer formed on the electroless metal layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
-
-
12. An enclosure for an electronic device, comprising:
-
a first cover defining a first portion of an exterior surface of the electronic device; a second cover defining a second portion of the exterior surface of the electronic device; and a frame component that couples the first cover to the second cover and defines a third portion of the exterior surface of the electronic device; and a metal layer formed on an interior surface of the enclosure and structurally coupling the second cover to the frame component. - View Dependent Claims (13, 14, 15, 16, 17)
-
-
18. An electronic device comprising:
-
an enclosure piece defining a portion of an external surface of the electronic device and comprising; a dielectric substrate; a polymer layer disposed on the dielectric substrate and comprising an activated region; an electroless metal layer formed on the activated region; and an electroplated metal layer formed on the electroless metal layer and defining an electrical circuit trace; and an electronic circuit within the enclosure piece and electrically coupled to the electrical circuit trace. - View Dependent Claims (19, 20)
-
Specification