FLEXIBLE PRINTED CIRCUIT BOARD WITH NARROWER LINE WIDTH

• US 20190230785A1
• Filed: 12/19/2018
• Published: 07/25/2019
• Est. Priority Date: 01/25/2018
• Status: Active Grant

• Current Assignee: GigaLane Co., Ltd.
• Original Assignee: GigaLane Co., Ltd.
• Inventors: Kim, Sang Pil, Jo, Byung Hoon, Lee, Da Yeon, Kim, Byung Yeol, Jung, Hee seok
• Granted Patent: US 10,448,499 B2
• Time in Patent Office: Days
• CPC Class Codes: H05K 1/0221 Coaxially shielded signal lines comprising a continuous shielding layer partially or wholly surrounding the signal lines
• CPC Class Codes: H05K 1/0222 for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence
• CPC Class Codes: H05K 1/028 Bending or folding regions of flexible printed circuits H05K1/0283 takes precedence
• CPC Class Codes: H05K 1/115 Via connections; Lands around holes or via connections H05K1/112 takes precedence
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 2201/09263 Meander
• CPC Class Codes: H05K 2201/09327 Special sequence of power, ground and signal layers in multilayer PCB
• CPC Class Codes: H05K 2201/09618 Via fence, i.e. one-dimensional array of vias
• CPC Class Codes: H05K 2201/09709 Staggered pads, lands or terminals; Parallel conductors in different planes

Abstract

In one example, a flexible circuit board includes a signal line disposed between a first ground and a second ground; a dielectric disposed between the first ground and the signal line and between the second ground and the signal line; and via holes formed by filling a plurality of holes, which are formed in a vertical direction such that the first ground and the second ground are electrically connected, with conductors, wherein the signal line is laterally bent so as to be spaced apart from positions where the via holes are formed.

Claims

1. A flexible circuit board with a reduced line width, comprising:

a signal line disposed between a first ground and a second ground;

a dielectric disposed between the first ground and the signal line and between the second ground and the signal line; and

via holes formed by filling a plurality of holes, which are formed in a vertical direction such that the first ground and the second ground are electrically connected, with conductors,

wherein the signal line is laterally bent so as to be spaced apart from positions where the via holes are formed.

3. The flexible circuit board of claim 1, wherein the via holes include a first via hole, a second via hole, and a third via hole which are spaced apart from each other along an extending direction of the signal line,

the first via hole is located at one side of the signal line,

the second via hole is located at the other side of the signal line,

the third via hole is located at the one side of the signal line, and

the signal line is laterally bent so as to be spaced apart from positions where the first via hole, the second via hole, and the third via hole are formed.

4. The flexible circuit board of claim 3, further comprising a shielding portion which is spaced apart from the signal line on the same layer as the signal line and extends in the extending direction of the signal line between the first via hole and the third via hole.

2. A flexible circuit board with a reduced line width, comprising:

a signal line disposed between a first ground and a second ground;

a dielectric disposed between the first ground and the signal line and between the second ground and the signal line; and

via holes formed by filling a plurality of trenches, which are formed in a vertical direction such that the first ground and the second ground are electrically connected, with conductors, wherein one side of the conductor is surrounded by the trench to face the signal line in a widthwise direction of the signal line and the other side of the conductor is exposed to the outside,

wherein the signal line is laterally bent so as to be spaced apart from positions where the via holes are formed.

5. The flexible circuit board of claim 2, wherein the via holes include a first via hole, a second via hole, and a third via hole which are spaced apart from each other along an extending direction of the signal line,

the first via hole is located at one side of the signal line,

the second via hole is located at the other side of the signal line,

the third via hole is located at the one side of the signal line, and

the signal line is laterally bent so as to be spaced apart from positions where the first via hole, the second via hole, and the third via hole are formed.

6. The flexible circuit board of claim 5, further comprising a shielding portion which is spaced apart from the signal line on the same layer as the signal line and extends in the extending direction of the signal line between the first via hole and the third via hole.