Photonic Package and Method Forming Same

• US 20190250327A1
• Filed: 04/22/2019
• Published: 08/15/2019
• Est. Priority Date: 06/30/2017
• Status: Active Grant

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Inventors: Huang, Sung-Hui, Lai, Jui Hsieh, Huang, Tien-Yu, Chen, Wen-Cheng, Lin, Yushun
• Granted Patent: US 10,459,159 B2
• Time in Patent Office: Days
• CPC Class Codes: G02B 6/12002 Three-dimensional structures
• CPC Class Codes: G02B 6/12004 Combinations of two or more optical elements
• CPC Class Codes: G02B 6/13 Integrated optical circuits characterised by the manufacturing method
• CPC Class Codes: G02B 6/30 for use between fibre and thin-film device
• CPC Class Codes: G02B 6/34 utilising prism or grating G02B6/293 takes precedence
• CPC Class Codes: G02B 6/42 Coupling light guides with opto-electronic elements
• CPC Class Codes: G02B 6/4214 the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device G02B6/4246 takes precedence
• CPC Class Codes: G02B 6/4239 Adhesive bonding; Encapsulation with polymer material
• CPC Class Codes: G02B 6/4274 Electrical aspects G02B6/4263 and G02B6/4265 take precedence
• CPC Class Codes: G02B 6/428 containing printed circuit boards [PCB]
• CPC Class Codes: G02B 6/43 Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector

Abstract

A method includes bonding an electronic die to a photonic die. The photonic die includes an opening. The method further includes attaching an adapter onto the photonic die, with a portion of the adapter being at a same level as a portion of the electronic die, forming a through-hole penetrating through the adapter, with the through-hole being aligned to the opening, and attaching an optical device to the adapter. The optical device is configured to emit a light into the photonic die or receive a light from the photonic die.

Claims

1. A package comprising:

a photonic die comprising a first hole and a second hole;

a silicon adapter over and attached to the photonic die, wherein the silicon adapter comprises a third hole and a fourth hole aligned to, and joined to, the first hole and the second hole, respectively;

an optical coupler comprising a portion overlapping the first hole and the third hole; and

a lamp overlapping the second hole and the fourth hole.

2. The package of claim 1, wherein the optical coupler further comprises an optical fiber, wherein the optical fiber extends into both of the first hole and the third hole.

3. The package of claim 1, wherein the silicon adapter comprises a dielectric liner lining sidewalls of the first hole and the second hole.

4. The package of claim 1 further comprising an adhesive adhering the silicon adapter to the photonic die.

5. The package of claim 1 further comprising an encapsulant encapsulating the silicon adapter therein.

6. The package of claim 5 further comprising an electronic die bonded to the photonic die, wherein the encapsulant further encapsulates the electronic die therein.

7. The package of claim 6 further comprising an underfill between the electronic die and the photonic die.

8. The package of claim 1 further comprising an optical adhesive filling the second hole and the fourth hole.

9. A package comprising:

a photonic die comprising a first hole;

an adapter over and attached to the photonic die, wherein the adapter comprises a second hole aligned to, and joined to, the first hole, and the adapter comprises a first top surface, wherein the adapter comprises;

a silicon-based structure; and

an oxide layer lining the second hole;

a molding compound encircling the adapter, wherein the molding compound comprises a second top surface;

an optical adhesive over and contacting the first top surface and the second top surface; and

an optical coupler comprising a portion overlapping the first hole, wherein the optical coupler is at least partially in the optical adhesive.

10. The package of claim 9, wherein the optical adhesive further extends into the first hole.

11. The package of claim 9, wherein the optical adhesive further extends into the second hole.

12. The package of claim 9, wherein the optical coupler comprises an optical fiber extending into the first hole and the second hole.

13. The package of claim 9, wherein the silicon-based structure comprises a bottom surface, and the oxide layer comprises a portion contacting the bottom surface of the silicon-based structure to form a horizontal interface.

14. The package of claim 9 further comprising an adhesive between and contacting the adapter and the photonic die.

15. The package of claim 14, wherein the molding compound is further in physical contact with the adhesive.

16. The package of claim 9 further comprising an electronic die bonded to the photonic die, wherein the electronic die is encapsulated in the molding compound.

17. A package comprising:

a photonic die;

an electronic die over and bonded to the photonic die;

an adapter over and attached to the photonic die;

an optical coupler aligned to a first portion of the adapter, wherein the optical coupler comprises an optical fiber configured to optically couple to a first optical device in the photonic die through the adapter; and

a radiation source over and aligned to a second portion of the adapter, wherein the radiation source is configured to optically couple to a second optical device in the photonic die through the adapter.

18. The package of claim 17, wherein top surfaces of the adapter and the electronic die are coplanar.

19. The package of claim 17 further comprising an encapsulant encapsulating the adapter and the electronic die therein, wherein top surfaces of the adapter, the encapsulant, and the electronic die are coplanar.

20. The package of claim 19, wherein the adapter comprises:

a silicon-based plate; and

a silicon oxide liner lining sidewalls of a first through-hole and a second through-hole of the silicon-based plate, wherein the optical coupler and the radiation source are optically coupled to the photonic die through the first through-hole and the second through-hole.