MULTI-LAYERED COUNTERFLOW EXPANDING MICROCHANNEL COOLING ARCHITECTURE AND SYSTEM THEREOF

• US 20190271513A1
• Filed: 05/09/2019
• Published: 09/05/2019
• Est. Priority Date: 10/11/2016
• Status: Active Grant

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Chainer, Timothy Joseph, Parida, Pritish Ranjan, Yang, Fanghao
• Granted Patent: US 10,641,558 B2
• Time in Patent Office: Days
• CPC Class Codes: F28D 1/0341 with U-flow or serpentine-flow inside the conduits
• CPC Class Codes: F28D 15/00 Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies F28D17/00, F28D19/00, F28D20/00 take precedence
• CPC Class Codes: F28D 15/0233 the conduits having a particular shape, e.g. non-circular cross-section, annular F28D15/0241, F28D15/0266 take precedence
• CPC Class Codes: F28D 15/025 having non-capillary condensate return means
• CPC Class Codes: F28D 15/0258 with means to remove contaminants, e.g. getters
• CPC Class Codes: F28D 15/0266 with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers F28D15/043 takes precedence
• CPC Class Codes: F28D 2021/0028 for cooling heat generating elements, e.g. for cooling electronic components or electric devices
• CPC Class Codes: F28F 3/086 having one or more openings therein forming tubular heat-exchange passages
• CPC Class Codes: F28F 3/12 Elements constructed in the shape of a hollow panel, e.g. with channels F28D1/02, F28D1/03 take precedence
• CPC Class Codes: H01L 23/3736 Metallic materials H01L23/3732, H01L23/3733, H01L23/3735, H01L23/3737, H01L23/3738 take precedence
• CPC Class Codes: H01L 23/3737 Organic materials with or without a thermoconductive filler
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H05K 7/20309 Evaporators

Abstract

Devices that have integrated cooling structures for counterflow, two-phase cooling and systems thereof are provided. In one example, a first structure can comprise a first cooling channel. The first cooling channel can have a first value of width that increases as the first cooling channel extends from a first side of a heat transfer area towards a second side of the heat transfer area. Also, a second structure can comprise a second cooing channel. The second cooling channel can have a second value of width that increases as the second cooling channel extends from the second side of the heat transfer area towards the first side of the heat transfer area.

Claims

1. A device, comprising:

a first structure having a first cooling channel, wherein a first value of width of the first cooling channel increases as the first cooling channel extends from a first side of a heat transfer area towards a second side of the heat transfer area; and

a second structure having a second cooling channel, wherein a second value of width of the second cooling channel increases as the second cooling channel extends from the second side of the heat transfer area towards the first side of the heat transfer area.

2. The device of claim 1, wherein the first structure has a plurality of first cooling channels.

3. The device of claim 2, wherein the second structure has a plurality of second cooling channels.

4. The device of claim 1, wherein the first structure also has an inlet hole positioned outside the heat transfer area.

5. The device of claim 4, wherein the second structure also has an inlet feed area positioned outside the heat transfer area.

6. The device of claim 1, further comprising:

a third structure having a third cooling channel, wherein a third value of width of the third cooling channel increases as the third cooling channel extends from the first side of the heat transfer area towards the second side of the heat transfer area.

7. The device of claim 1, further comprising:

a third structure having a third cooling channel, wherein a third value of width of the third cooling channel increases as the third cooling channel extends from a third side of the heat transfer area towards a fourth side of the heat transfer area.

8. A device, comprising:

a first manifold having a first cooling channel, wherein a first value of width of the first cooling channel increases as the first cooling channel extends from a first side of a heat transfer area towards a second side of the heat transfer area;

a second manifold having a second cooling channel, wherein a second value of width of the second cooling channel increases as the second cooling channel extends from the second side of the heat transfer area towards the first side of the heat transfer area, wherein the first manifold traverses a first plane and the second manifold traverses a second plane.

9. The device of claim 8, wherein the first manifold has a plurality of first cooling channels.

10. The device of claim 9, wherein the second manifold has a plurality of second cooling channels.

11. The device of claim 8, wherein the first manifold further comprises a first inlet channel adjacent to the first side of the heat transfer area, and wherein the second manifold further comprises a second inlet channel adjacent to the second side of the heat transfer area.

12. The device of claim 8, wherein the first manifold is adjacent to the second manifold.

13. The device of claim 12, wherein the first cooling channel traverses a first section of the heat transfer area and the second cooling channel traverses a second section of the heat transfer area, and wherein the first section is adjacent to the second section.

14. The device of claim 8, further comprising:

a third manifold having a third cooling channel, wherein a third value of width of the third cooling channel increases as the third cooling channel extends from the first side of the heat transfer area towards the second side of the heat transfer area.

15. The device of claim 8, further comprising:

a third manifold having a third cooling channel, wherein a third value of width of the third cooling channel increases as the third cooling channel extends from a third side of the heat transfer area towards a fourth side of the heat transfer area.

16. A system, comprising:

a pump that propels a fluid into a manifold device, wherein the manifold device comprises;

a first manifold having a first cooling channel, wherein a first value of width of the first cooling channel increases as the first cooling channel extends from a first side of a heat transfer area towards a second side of the heat transfer area, and

a second manifold having a second cooling channel, wherein a second value of width of the second cooling channel increases as the second cooling channel extends from the second side of the heat transfer area towards the first side of the heat transfer area; and

a reservoir that collects the fluid exiting the manifold device.

17. The system of claim 16, further comprising:

a condenser that condenses the fluid exiting the manifold device.

18. The system of claim 16, wherein the pump propels the fluid into the manifold device through an inlet port positioned at a side of the manifold device.

19. The system of claim 18, wherein the inlet port is outside the heat transfer area.

20. The system of claim 16, wherein the pump propels the fluid to flow through the heat transfer area in multiple directions.