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LIGHT-EMITTING DIODE PACKAGE AND METHOD OF MANUFACTURING THE SAME

  • US 20190280162A1
  • Filed: 09/12/2018
  • Published: 09/12/2019
  • Est. Priority Date: 03/09/2018
  • Status: Active Grant
First Claim
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1. A light-emitting diode (LED) package comprising:

  • an LED having an upper surface, a lower surface, and side surfaces connecting the upper surface and the lower surface, and configured to generate and emit light, the LED having a polygonal shape in a plan view of the LED package;

    a light-transmissive layer covering the upper surface and at least some portions of the side surfaces of the LED, and configured to direct the light emitted from the LED in an upward direction;

    a wavelength conversion layer disposed on the light-transmissive layer, and configured to change a wavelength of the light emitted through the light-transmissive layer; and

    a coating layer covering side surfaces of the light-transmissive layer, and configured to reflect the light emitted through the light-transmissive layer in the upward direction at an interface with the light-transmissive layer,wherein, in a sectional view of the LED package, the side surfaces of the light-transmissive layer are inclined with respect to the side surfaces of the LED, andwherein, in the plan view of the LED package, a length from a first point of the light-transmissive layer corresponding to a vertex of the LED to a second point of the light-transmissive layer corresponding to an end of an extension of a diagonal of the LED is greater than or equal to a length from the first point to a third point of the light-transmissive layer corresponding to an end of an extension of a side of the LED.

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