LED PACKAGING MATERIAL AND MANUFACTURING METHOD OF THE SAME
First Claim
Patent Images
1. A method for manufacturing a light-emitting diode (LED) packaging material, comprising the following steps:
- mixing graphene with a curing agent at a predetermined ratio to form a first mixed solution including a mixture of graphene and the curing agent;
providing epoxy resin and an accelerating agent with a predetermined ratio, and adding the epoxy resin and the accelerating agent into the first mixed solution of graphene and the curing agent to form a second mixed solution, which comprises the mixture of graphene and the curing agent that is added with epoxy resin and the accelerating agent; and
subjecting the second mixed solution to an ultrasonic process to form a material of a fully-mixed combination of graphene and epoxy resin,wherein the first mixed solution is formed by mixing graphene and the curing agent before epoxy resin is added in the first mixed solution.
1 Assignment
0 Petitions
Accused Products
Abstract
A light-emitting diode (LED) packaging material is formed by compounding graphene with silane or epoxy resin, to improve the defects of manufacturing an LED packaging material only of silane or epoxy resin. The addition of graphene helps improve the performance of the LED packaging material. Also provided is a manufacturing method of a LED packaging material.
-
Citations
8 Claims
-
1. A method for manufacturing a light-emitting diode (LED) packaging material, comprising the following steps:
-
mixing graphene with a curing agent at a predetermined ratio to form a first mixed solution including a mixture of graphene and the curing agent; providing epoxy resin and an accelerating agent with a predetermined ratio, and adding the epoxy resin and the accelerating agent into the first mixed solution of graphene and the curing agent to form a second mixed solution, which comprises the mixture of graphene and the curing agent that is added with epoxy resin and the accelerating agent; and subjecting the second mixed solution to an ultrasonic process to form a material of a fully-mixed combination of graphene and epoxy resin, wherein the first mixed solution is formed by mixing graphene and the curing agent before epoxy resin is added in the first mixed solution. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
-
Specification