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METHOD FOR EMBEDDING ELECTRONICS INTO A PUCK AND PUCK HAVING EMBEDDED ELECTRONICS

  • US 20190308076A1
  • Filed: 03/08/2019
  • Published: 10/10/2019
  • Est. Priority Date: 03/09/2018
  • Status: Active Grant
First Claim
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1. A puck having a centrally located cavity, the puck comprising:

  • a carrier structure having a rigid shell, the carrier structure being positioned within the centrally located cavity;

    at least one transmitter circuit supported by the carrier structure; and

    a battery provided within the carrier structure,wherein the battery is embedded in a first elastic material provided within the carrier structure, and wherein the carrier structure is embedded in a second elastic material provided within the centrally located cavity.

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