METHOD FOR EMBEDDING ELECTRONICS INTO A PUCK AND PUCK HAVING EMBEDDED ELECTRONICS
First Claim
1. A puck having a centrally located cavity, the puck comprising:
- a carrier structure having a rigid shell, the carrier structure being positioned within the centrally located cavity;
at least one transmitter circuit supported by the carrier structure; and
a battery provided within the carrier structure,wherein the battery is embedded in a first elastic material provided within the carrier structure, and wherein the carrier structure is embedded in a second elastic material provided within the centrally located cavity.
1 Assignment
0 Petitions
Accused Products
Abstract
A puck embedding at least one transmitter circuit, and a method for producing a puck embedding at least one transmitter circuit. To protect the electronics from displacement or damage, the puck employs a layered structure. The puck has a centrally located cavity, containing a carrier structure having a rigid shell, at least one transmitter circuit supported by the carrier structure, and a battery provided within the carrier structure. The battery is embedded in a first elastic material provided within the carrier structure. The carrier structure is embedded in a second elastic material provided within the centrally located cavity.
9 Citations
20 Claims
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1. A puck having a centrally located cavity, the puck comprising:
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a carrier structure having a rigid shell, the carrier structure being positioned within the centrally located cavity; at least one transmitter circuit supported by the carrier structure; and a battery provided within the carrier structure, wherein the battery is embedded in a first elastic material provided within the carrier structure, and wherein the carrier structure is embedded in a second elastic material provided within the centrally located cavity. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. A method for producing a puck comprising at least one transmitter circuit, comprising:
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assembling a battery into a carrier structure having a rigid shell; attaching at least one transmitter circuit to the carrier structure; filling the inner volume of the carrier structure with a first elastic material; inserting the carrier structure into a recess on the inner surface of a first half of the puck; filling the remaining space with a second elastic material; and glueing a second half of the puck to the first half of the puck, wherein the second half of the puck has a recess such that the recess in the first half of the puck and the recess in the second half of the puck combine to form a cavity which is centrally located within the puck. - View Dependent Claims (18, 19, 20)
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Specification