RESIN COMPOSITION, METHOD FOR PRODUCING RESIN COMPOSITION, RESIN COMPOSITION MOLDED BODY, AND METHOD FOR PRODUCING RESIN COMPOSITION MOLDED BODY

• US 20190309143A1
• Filed: 11/27/2017
• Published: 10/10/2019
• Est. Priority Date: 11/28/2016
• Status: Active Grant

• Current Assignee: Somar Pty Limited
• Original Assignee: Somar Pty Limited
• Inventors: ISHIZAKI, Hirohisa, OCHIAI, Akira
• Granted Patent: US 11,578,183 B2
• Time in Patent Office: Days
• CPC Class Codes: B29C 35/02 Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mouldcold vulcanisation B29C35/18 ; vulcanising tyres, presses therefor B29D30/0601
• CPC Class Codes: C01P 2006/42 Magnetic properties
• CPC Class Codes: C07C 255/54 containing cyano groups and etherified hydroxy groups bound to the carbon skeleton
• CPC Class Codes: C08F 2/46 Polymerisation initiated by wave energy or particle radiation
• CPC Class Codes: C08J 3/092 Hydrocarbons
• CPC Class Codes: C08K 2003/2265 of iron
• CPC Class Codes: C08K 2003/2275 Ferroso-ferric oxide (Fe3O4)
• CPC Class Codes: C08K 2201/01 Magnetic additives
• CPC Class Codes: C08K 3/00 Use of inorganic substances as compounding ingredients
• CPC Class Codes: C08K 3/22 of metals
• CPC Class Codes: C08K 5/00 Use of organic ingredients
• CPC Class Codes: C08K 9/04 Ingredients treated with organic substances treated with macromolecular compounds C08K9/08
• CPC Class Codes: C08L 101/00 Compositions of unspecified macromolecular compounds
• CPC Class Codes: C08L 15/005 Hydrogenated nitrile rubber
• CPC Class Codes: C08L 63/00 Compositions of epoxy resins; Compositions of derivatives of epoxy resins
• CPC Class Codes: C08L 63/08 Epoxidised polymerised polyenes
• CPC Class Codes: C08L 67/04 Polyesters derived from hydroxycarboxylic acids, e.g. lactones C08L67/06 takes precedence
• CPC Class Codes: C08L 75/04 Polyurethanes
• CPC Class Codes: C08L 83/04 Polysiloxanes
• CPC Class Codes: C09D 5/23 Magnetisable or magnetic paints or lacquers
• CPC Class Codes: C09D 7/61 : inorganic
• CPC Class Codes: H01F 1/0027 : Thick magnetic films forming thick magnetic films H01F41/16
• CPC Class Codes: H01F 1/28 : dispersed or suspended in a bonding agent

Abstract

A resin composition including: a magnetic fluid that includes magnetic particles, a dispersant, and a dispersion medium; and a resin or precursor thereof that includes, in a molecule thereof, at least one partial structure selected from the group consisting of a diene skeleton, a silicone skeleton, a urethane skeleton, a 4- to 7-membered ring lactone skeleton, an alkyl group having from 6 to 30 carbon atoms and an alkylene group having from 6 to 30 carbon atoms, a production method thereof, a resin composition molded body obtained by using the resin composition, and a production method thereof.

Claims

1. A resin composition comprising:

a magnetic fluid that includes magnetic particles, a dispersant, and a dispersion medium; and

a resin or precursor thereof that includes, in a molecule thereof, at least one partial structure selected from the group consisting of a diene skeleton, a silicone skeleton, a urethane skeleton, a 4- to 7-membered ring lactone skeleton, an alkyl group having from 6 to 30 carbon atoms and an alkylene group having from 6 to 30 carbon atoms.

2. The resin composition according to claim 1, wherein the resin is at least one thermosetting resin selected from the group consisting of an epoxy resin, a silicone resin and a polyurethane resin.

3. The resin composition according to claim 2, wherein the epoxy resin is at least one selected from the group consisting of a rubber-modified epoxy resin, a dimer acid-modified epoxy resin, a trimer acid-modified epoxy resin and a silicone-modified epoxy resin.

4. The resin composition according to claim 1, wherein the precursor includes at least one selected from the group consisting of a polyol and an alkenyl group-containing organo polysiloxane.

5. The resin composition according to claim 1, wherein a content of the dispersion medium with respect to a total amount of the resin composition is 5% by mass or less.

6. The resin composition according to claim 1, further comprising at least one selected from the group consisting of a curing agent and a cross-linking agent.

7. The resin composition according to claim 1, further comprising a resin or precursor thereof that does not include, in a molecule thereof, at least one partial structure selected from the group consisting of a diene skeleton, a silicone skeleton, a urethane skeleton, a 4- to 7-membered ring lactone skeleton, an alkyl group having from 6 to 30 carbon atoms and an alkylene group having from 6 to 30 carbon atoms.

8. The resin composition according to claim 1, wherein a content of the resin or precursor thereof that includes, in a molecule thereof, at least one partial structure selected from the group consisting of a diene skeleton, a silicone skeleton, a urethane skeleton, a 4- to 7-membered ring lactone skeleton, an alkyl group having from 6 to 30 carbon atoms and an alkylene group having from 6 to 30 carbon atoms, with respect to a total content of resins or precursors thereof incorporated in the resin composition, is from 10% by mass to 100% by mass.

9. A resin composition molded body that is a cured body of the resin composition according to claim 7.

12. The resin composition according to claim 3, wherein a content of the dispersion medium with respect to a total amount of the resin composition is 5% by mass or less.

13. The resin composition according to claim 4, wherein a content of the dispersion medium with respect to a total amount of the resin composition is 5% by mass or less.

14. The resin composition according to claim 12, further comprising a resin or precursor thereof that does not include, in a molecule thereof, at least one partial structure selected from the group consisting of a diene skeleton, a silicone skeleton, a urethane skeleton, a 4- to 7-membered ring lactone skeleton, an alkyl group having from 6 to 30 carbon atoms and an alkylene group having from 6 to 30 carbon atoms.

15. The resin composition according to claim 13, further comprising a resin or precursor thereof that does not include, in a molecule thereof, at least one partial structure selected from the group consisting of a diene skeleton, a silicone skeleton, a urethane skeleton, a 4- to 7-membered ring lactone skeleton, an alkyl group having from 6 to 30 carbon atoms and an alkylene group having from 6 to 30 carbon atoms.

16. The resin composition according to claim 12, wherein a content of the resin or precursor thereof that includes, in a molecule thereof, at least one partial structure selected from the group consisting of a diene skeleton, a silicone skeleton, a urethane skeleton, a 4- to 7-membered ring lactone skeleton, an alkyl group having from 6 to 30 carbon atoms and an alkylene group having from 6 to 30 carbon atoms, with respect to a total content of resins or precursors thereof incorporated in the resin composition, is from 10% by mass to 100% by mass.

17. The resin composition according to claim 13, wherein a content of the resin or precursor thereof that includes, in a molecule thereof, at least one partial structure selected from the group consisting of a diene skeleton, a silicone skeleton, a urethane skeleton, a 4- to 7-membered ring lactone skeleton, an alkyl group having from 6 to 30 carbon atoms and an alkylene group having from 6 to 30 carbon atoms, with respect to a total content of resins or precursors thereof incorporated in the resin composition, is from 10% by mass to 100% by mass.

18. The resin composition according to claim 7, wherein a content of the resin or precursor thereof that includes, in a molecule thereof, at least one partial structure selected from the group consisting of a diene skeleton, a silicone skeleton, a urethane skeleton, a 4- to 7-membered ring lactone skeleton, an alkyl group having from 6 to 30 carbon atoms and an alkylene group having from 6 to 30 carbon atoms, with respect to a total content of resins or precursors thereof incorporated in the resin composition, is from 10% by mass to 100% by mass.

19. A resin composition molded body that is a cured body of the resin composition according to claim 1.

10. A method for producing a resin composition, the method comprising:

preparing a resin mixture including a magnetic fluid that includes magnetic particles, a dispersant, and a dispersion medium, and a resin or precursor thereof that includes, in a molecule thereof, at least one partial structure selected from the group consisting of a diene skeleton, a silicone skeleton, a urethane skeleton, a 4- to 7-membered ring lactone skeleton, an alkyl group having from 6 to 30 carbon atoms and an alkylene group having from 6 to 30 carbon atoms; and

heating the resin mixture to remove the dispersion medium.

11. A method for producing a resin composition molded body, the method comprising:

preparing a resin mixture including a magnetic fluid that includes magnetic particles, a dispersant, and a dispersion medium, and a resin or precursor thereof that includes, in a molecule thereof, at least one partial structure selected from the group consisting of a diene skeleton, a silicone skeleton, a urethane skeleton, a 4- to 7-membered ring lactone skeleton, an alkyl group having from 6 to 30 carbon atoms and an alkylene group having from 6 to 30 carbon atoms;

heating the resin mixture to remove the dispersion medium; and

heat molding the resin mixture from which the dispersion medium has been removed.