HIGHLY FILLED HIGH THERMAL CONDUCTIVE MATERIAL, METHOD FOR MANUFACTURING SAME, COMPOSITION, COATING LIQUID AND MOLDED ARTICLE

• US 20190309204A1
• Filed: 01/10/2019
• Published: 10/10/2019
• Est. Priority Date: 11/21/2012
• Status: Active Grant

• Current Assignee: Takagi Chemicals, Inc.
• Original Assignee: Takagi Chemicals, Inc.
• Inventors: Takagi, Noriaki, Nagatani, Yuusuke, Terao, Yuuta, Matsuyama, Kazuo, Takeichi, Tsutomu, Matsumoto, Akihiko
• Granted Patent: US 10,851,277 B2
• Time in Patent Office: Days
• CPC Class Codes: B32B 2250/02 2 layers
• CPC Class Codes: B32B 2250/24 All layers being polymeric
• CPC Class Codes: B32B 2260/025 Particulate layer
• CPC Class Codes: B32B 2260/046 Synthetic resin
• CPC Class Codes: B32B 2262/101 Glass fibres
• CPC Class Codes: B32B 2262/103 Metal fibres
• CPC Class Codes: B32B 2262/106 Carbon fibres, e.g. graphite fibres
• CPC Class Codes: B32B 2264/0207 Particles made of materials belonging to B32B25/00
• CPC Class Codes: B32B 2264/0214 Particles made of materials belonging to B32B27/00
• CPC Class Codes: B32B 2264/0221 Thermoplastic elastomer particles
• CPC Class Codes: B32B 2264/0235 Aromatic vinyl resin, e.g. styrenic (co)polymers
• CPC Class Codes: B32B 2264/0242 Vinyl halide, e.g. PVC, PVDC, PVF or PVDF (co)polymers
• CPC Class Codes: B32B 2264/025 Acrylic resin particles, e.g. polymethyl methacrylate or ethylene-acrylate copolymers
• CPC Class Codes: B32B 2264/0257 Polyolefin particles, e.g. polyethylene or polypropylene homopolymers or ethylene-propylene copolymers
• CPC Class Codes: B32B 2264/0264 Polyamide particles
• CPC Class Codes: B32B 2264/0278 Polyester particles
• CPC Class Codes: B32B 2264/0285 PET or PBT
• CPC Class Codes: B32B 2264/101 Glass
• CPC Class Codes: B32B 2264/102 Oxide or hydroxide
• CPC Class Codes: B32B 2264/104 Oxysalt, e.g. carbonate, sulfate, phosphate or nitrate particles
• CPC Class Codes: B32B 2264/105 : Metal
• CPC Class Codes: B32B 2264/107 : Ceramic
• CPC Class Codes: B32B 2264/108 : Carbon, e.g. graphite particles
• CPC Class Codes: B32B 2264/12 : Mixture of at least two particles made of different materials
• CPC Class Codes: B32B 2307/202 : Conductive
• CPC Class Codes: B32B 2307/302 : Conductive
• CPC Class Codes: B32B 2307/304 : Insulating
• CPC Class Codes: B32B 2307/308 : Heat stability
• CPC Class Codes: B32B 2307/54 : Yield strength; Tensile strength
• CPC Class Codes: B32B 2307/546 : Flexural strength; Flexion stiffness
• CPC Class Codes: B32B 2307/58 : Cuttability
• CPC Class Codes: B32B 2307/72 : Density
• CPC Class Codes: B32B 2307/734 : Dimensional stability
• CPC Class Codes: B32B 2451/00 : Decorative or ornamental articles
• CPC Class Codes: B32B 2457/08 : PCBs, i.e. printed circuit boards
• CPC Class Codes: B32B 2457/14 : Semiconductor wafers
• CPC Class Codes: B32B 2457/18 : Fuel cells
• CPC Class Codes: B32B 2457/202 : LCD, i.e. liquid crystal displays
• CPC Class Codes: B32B 27/08 : of synthetic resin
• CPC Class Codes: B32B 27/20 : using fillers, pigments, thixotroping agents
• CPC Class Codes: B32B 27/286 : comprising polysulphones; polysulfides
• CPC Class Codes: B32B 27/36 : comprising polyesters
• CPC Class Codes: B32B 5/022 : Non-woven fabric
• CPC Class Codes: B32B 5/16 : characterised by features of a layer formed of particles, e.g. chips, powder or granules layer formed of natural mineral particles B32B19/00; layer being formed of wood fibres, chips or particles B32B21/02
• CPC Class Codes: B32B 5/24 : one layer being a fibrous or filamentary layer
• CPC Class Codes: B32B 5/30 : one layer being formed of particles, e.g. chips, granules, powder
• CPC Class Codes: B32B 7/025 : Electric or magnetic properties
• CPC Class Codes: B32B 7/027 : Thermal properties
• CPC Class Codes: B32B 7/04 : Interconnection of layers
• CPC Class Codes: C08K 2003/385 : Binary compounds of nitrogen with boron
• CPC Class Codes: C08K 2201/005 : Additives being defined by their particle size in general
• CPC Class Codes: C08K 3/04 : Carbon
• CPC Class Codes: C08K 3/38 : Boron-containing compounds
• CPC Class Codes: C08K 7/06 : Elements
• CPC Class Codes: C08K 7/14 : Glass
• CPC Class Codes: C08L 101/00 : Compositions of unspecified macromolecular compounds
• CPC Class Codes: C08L 23/04 : Homopolymers or copolymers of ethene
• CPC Class Codes: C08L 67/02 : Polyesters derived from dicarboxylic acids and dihydroxy compounds C08L67/06 takes precedence
• CPC Class Codes: C08L 69/00 : Compositions of polycarbonates; Compositions of derivatives of polycarbonates
• CPC Class Codes: C08L 81/04 : Polysulfides
• CPC Class Codes: C09D 201/00 : Coating compositions based on unspecified macromolecular compounds
• CPC Class Codes: C09D 5/24 : Electrically-conducting paints conductive materials H01B1/00
• CPC Class Codes: C09D 7/40 : Additives
• CPC Class Codes: C09D 7/61 : inorganic
• CPC Class Codes: C09K 5/14 : Solid materials, e.g. powdery or granular
• CPC Class Codes: Y10T 428/31786 : Of polyester [e.g., alkyd, etc.]

Abstract

[Problem] Provided are a high filler-loaded high thermal conductive material which sufficiently utilizes features of an organic polymer while ameliorating drawbacks, enables integrated molding with ceramics, metals, semiconductor elements and the like, and has a low coefficient of thermal expansion and a high thermal conductivity; and a method for producing the high filler-loaded high thermal conductive material, a composition, coating liquid and a molded article.

[Solution] Disclosed is a high filler-loaded high thermal conductive material formed by subjecting a composition which includes organic polymer particles and a thermally conductive filler having a graphite-like structure, and includes 5 to 60% by weight of the organic polymer particles and 40 to 95% by weight of the thermally conductive filler having a graphite-like structure relative to 100% by weight of the total amount of these components, is obtained, so that the thermally conductive filler is dispersed by delamination while maintaining the average planar particle size of the thermally conductive filler, and is capable of forming a thermally conductive infinite cluster; to press molding at a temperature higher than equal to the deflection temperature under load, melting point or glass transition temperature of the organic polymer and a pressure of 1 to 1000 kgf/cm²; and to cooling and solidification.

Claims

1. A high filler-loaded high thermal conductive material, formed by subjecting a composition which comprises organic polymer particles comprising a thermoplastic polymer and a thermally conductive filler having a graphite-like structure, and comprises 5 to 60% by weight of the organic polymer particles and 40 to 95% by weight of the thermally conductive filler having a graphite-like structure relative to 100% by weight of the total amount of these components, is obtained by using a pulverizing machine so that the thermally conductive filler is dispersed by delamination while maintaining the average planar particle size of the thermally conductive filler, and is capable of forming a thermally conductive infinite cluster;

press molding at a temperature higher than equal to the deflection temperature under load, melting point or glass transition temperature of the organic polymer and a pressure of 1 to 1000 kgf/cm²; and

cooling and solidification.

2. The high filler-loaded high thermal conductive material according to claim 1, wherein the pulverizing machine is a ball mill.

3. The high filler-loaded high thermal conductive material according to claim 1, wherein the thermoplastic polymer contains at least one selected from the group consisting of a thermoplastic resin and a thermoplastic elastomer, all of which have crystallinity and/or aromaticity.

4. The high filler-loaded high thermal conductive material according to claim 1, wherein the thermoplastic polymer contains at least one selected from the group consisting of polyphenylene sulfide, polyethylene terephthalate, polybutylene terephthalate, and polycarbonate.

5. The high filler-loaded high thermal conductive material according to claim 1, wherein the organic polymer particles further contain an uncured thermosetting resin.

6. The high filler-loaded high thermal conductive material according to claim 5, wherein the uncured thermosetting resin contains at least one selected from benzoxazine.

7. The high filler-loaded high thermal conductive material according to claim 1, wherein the thermally conductive filler contains graphite.

8. The high filler-loaded high thermal conductive material according to claim 7, wherein the graphite contains natural graphite and/or artificial graphite.

9. The high filler-loaded high thermal conductive material according to claim 7, wherein the graphite contains scale-like graphite.

10. The high filler-loaded high thermal conductive material according to claim 7, wherein the high filler-loaded high thermal conductive material has a thermal conductivity of 10 to 150 W/mK,

a coefficient of thermal expansion of 3×

10<sup>−

6</sup> to 30×

10<sup>−

6</sup>°

C.<sup>−

1</sup>, and

a surface electrical conductivity of 5 to 200 (Ω

cm)<sup>−

1</sup>.

11. The high filler-loaded high thermal conductive material according to claim 1, wherein the thermally conductive filler contains thermally conductive ceramics.

12. The high filler-loaded high thermal conductive material according to claim 1, wherein the thermally conductive ceramics contains hexagonal boron nitride.

13. The high filler-loaded high thermal conductive material according to claim 11, wherein the high filler-loaded high thermal conductive material has a thermal conductivity of 5 to 50 W/mK,

a coefficient of thermal expansion of 3×

10<sup>−

6</sup> to 30×

10<sup>−

6</sup>°

C.<sup>−

1</sup>, and

an electrical conductivity of 10<sup>−

10</sup> (Ω

cm)<sup>−

1</sup> or less.

16. A molded article, comprising the high filler-loaded high thermal conductive material according to claim 1, and being used as a high thermal conduction/heat dissipation component.

17. The molded article according to claim 16, wherein the molded article is formed by laminating two layers of the high filler-loaded high thermal conductive material;

one layer of the two layers has a thermal conductivity of 15 to 120 W/mK and a coefficient of thermal expansion of 3×

10<sup>−

6</sup> to 30×

10<sup>−

6</sup>°

C.<sup>−

1</sup>, and exhibits electrical conductivity with a surface electrical conductivity of 10 to 200 (Ω

cm)<sup>−

1</sup>; and

the other layer of the two layers has a thermal conductivity of 5 to 50 W/mK or more and a coefficient of thermal expansion of 3×

10<sup>−

6</sup> to 10×

10<sup>−

6</sup>°

C.<sup>−

1</sup>, and exhibits insulating properties with a surface electrical conductivity of 10<sup>−

11</sup> (Ω

cm)<sup>−

1</sup> or less.

18. The molded article according to claim 17, wherein the layers of the high filler-loaded high thermal conductive material is formed of a gradient material.

14. A high filler-loaded composition, which comprises organic polymer particles comprising a thermoplastic polymer and an uncured thermosetting resin, and a thermally conductive filler having a graphite-like structure, comprises 5 to 60% by weight of the organic polymer particles, 40 to 95% by weight of the thermally conductive filler having a graphite-like structure, and 0 to 6% by weight of the uncured thermosetting resin relative to 100% by weight of the total amount of these components, is obtained by using a pulverizing machine so that the thermally conductive filler is dispersed by delamination while maintaining the average planar particle size of the thermally conductive filler, and is capable of forming a thermally conductive infinite cluster.

15. A coating liquid comprising the high filler-loaded composition according to claim 14, and a dispersing medium.