ELECTROLESS PLATINUM PLATING BATH

• US 20190309423A1
• Filed: 04/27/2017
• Published: 10/10/2019
• Est. Priority Date: 07/04/2016
• Status: Active Grant

• Current Assignee: C.Uyemura & Co., Ltd.
• Original Assignee: C.Uyemura & Co., Ltd.
• Inventors: SASAMURA, Tetsuya, TANABE, Katsuhisa, OKUBO, Hiroki, SOMEYA, Tatsushi, FURUYA, Eriko
• Granted Patent: US 10,822,704 B2
• Time in Patent Office: Days
• CPC Class Codes: C23C 18/1662 Use of incorporated material in the solution or dispersion, e.g. particles, whiskers, wires
• CPC Class Codes: C23C 18/44 using reducing agents

Abstract

An electroless platinum plating solution includes a soluble platinum compound, a complexing agent, a reducing agent, and a halide ion supplying agent, the reducing agent being formic acid.

Claims

1. An electroless platinum plating solution comprising

a soluble platinum compound, a complexing agent, a reducing agent, and a halide ion supplying agent, the reducing agent being formic acid.

2. The electroless platinum plating solution of claim 1, wherein

the halide ion supplying agent is included at a molar ratio of 10 or more with respect to platinum.

3. The electroless platinum plating solution of claim 2, wherein

the halide ion supplying agent is included at the molar ratio of 500 or less with respect to platinum.

4. The electroless platinum plating solution of claim 1, wherein

the halide ion supplying agent is an alkali metal halide.

5. The electroless platinum plating solution of claim 4, wherein

the alkali metal halide is at least one of sodium chloride, potassium chloride, sodium iodide, potassium iodide, sodium bromide, or potassium bromide.

6. The electroless platinum plating solution of claim 1, wherein

the electroless platinum plating solution has a pH of 9 or less.

7. The electroless platinum plating solution of claim 1, wherein

the soluble platinum compound is one of dinitrodiammine platinum, chloroplatinate, tetraammine platinum salt, and hexaammine platinum salt.

8. A method for manufacturing a platinum coating on a target by submerging the target into the electroless platinum plating solution of claim 1.