COMMUNICATION MODULE

• US 20190310435A1
• Filed: 04/05/2019
• Published: 10/10/2019
• Est. Priority Date: 04/10/2018
• Status: Abandoned Application

• Current Assignee: Fujitsu Component Limited (Fujitsu Limited)
• Original Assignee: Fujitsu Component Limited (Fujitsu Limited)
• Inventors: Akieda, Shinichiro, Daikuhara, Osamu
• Application Number:
  US16/376,309
• Publication Number:
  US 20190310435A1
• Time in Patent Office: Days
• CPC Class Codes: G02B 6/4262 characterised by the shape of the housing for semiconductor lasers H01S5/02208
• CPC Class Codes: G02B 6/4269 with heat sinks or radiation fins
• CPC Class Codes: G02B 6/4281 the printed circuit boards being flexible in general H05K1/147
• CPC Class Codes: G02B 6/4284 of optical modules with disconnectable electrical connectors latching arms for electrical connectors H01R13/627
• CPC Class Codes: H05K 1/0209 External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
• CPC Class Codes: H05K 1/0274 Optical details, e.g. printed circuits comprising integral optical means H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 2201/066 Heatsink mounted on the surface of the PCB heatsink inserted in the PCB H05K2201/10416
• CPC Class Codes: H05K 2201/10121 Optical component, e.g. opto-electronic component
• CPC Class Codes: H05K 2201/10522 Adjacent components
• CPC Class Codes: H05K 2201/10681 Tape Carrier Package [TCP]; Flexible sheet connector
• CPC Class Codes: H05K 7/20445 the coupling element being an additional piece, e.g. thermal standoff

Abstract

A communication module includes a housing, a circuit board in the housing, a heating element on the circuit board, and a heat dissipating member sandwiched between the inside surface of the housing and the heating element. The inside surface includes protrusions protruding toward the heating element.

Claims

1. A communication module comprising:

a housing;

a circuit board in the housing;

a heating element on the circuit board; and

a heat dissipating member sandwiched between an inside surface of the housing and the heating element,

wherein the inside surface includes a plurality of protrusions protruding toward the heating element.

2. The communication module as claimed in claim 1, wherein the protrusions are formed at regular intervals.

3. The communication module as claimed in claim 1, wherein each of the protrusions has a planar top.

4. The communication module as claimed in claim 1, wherein each of the protrusions has a rounded top.