STACKING MULTIPLE DIES HAVING DISSIMILAR INTERCONNECT STRUCTURE LAYOUT AND PITCH
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Abstract
An apparatus is provided comprising: first die, wherein a first plurality of interconnect structures is formed on the first die; one or more layers, wherein a first surface of the one or more layers is attached to the first plurality of interconnect structures; a second plurality of interconnect structures formed on a second surface of the one or more layers; and a second die, wherein a third plurality of interconnect structures is formed on the second die, wherein a first interconnect structure of the first plurality of interconnect structures is electrically connected to a second interconnect structure of the second plurality of interconnect structures through the one or more layers, and wherein the first die is mounted on the second die such that the second interconnect structure of the second plurality of interconnect structures is attached to a third interconnect structure of the third plurality of interconnect structures.
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Citations
48 Claims
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1-25. -25. (canceled)
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26. An apparatus comprising:
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a first die, wherein a first plurality of interconnect structures is on the first die; one or more layers, wherein a first surface of the one or more layers is adjacent to the first plurality of interconnect structures; a second plurality of interconnect structures on a second surface of the one or more layers; and a second die, wherein a third plurality of interconnect structures is on the second die, wherein a first interconnect structure of the first plurality of interconnect structures is electrically coupled to a second interconnect structure of the second plurality of interconnect structures through the one or more layers, and wherein the first die is on the second die such that the second interconnect structure of the second plurality of interconnect structures is adjacent to a third interconnect structure of the third plurality of interconnect structures via an attachment component. - View Dependent Claims (27, 28, 29, 30, 31, 32, 33, 34, 35, 36)
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37. A semiconductor package comprising:
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a first die, wherein a plurality of interconnect pads is on a first surface of the first die; one or more layers; a first plurality of interconnect structures coupled to the first surface of the first die via the one or more layers, and wherein each interconnect structure of the first plurality of interconnect structures is electrically coupled to a corresponding interconnect pad of the plurality of interconnect pads via the one or more layers; and a second die, wherein a second plurality of interconnect structures is on the second die, wherein the first die is mounted on the second die such that a first interconnect structure of the first plurality of interconnect structures is coupled to a second interconnect structure of the second plurality of interconnect structures via a solder. - View Dependent Claims (38, 39, 40, 41, 42, 43, 44)
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45. A method comprising:
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forming a first plurality of interconnect structures on a first die; forming one or more layers, wherein a first surface of the one or more layers is coupled to the first plurality of interconnect structures; forming a second plurality of interconnect structures on a second surface of the one or more layers, wherein a first interconnect structure of the first plurality of interconnect structures is electrically coupled to a second interconnect structure of the second plurality of interconnect structures through the one or more layers; and mounting the first die on a second die, wherein a third plurality of interconnect structures is formed on the second die, and wherein the first die is mounted on the second die such that the second interconnect structure of the second plurality of interconnect structures is coupled to a third interconnect structure of the third plurality of interconnect structures via solder. - View Dependent Claims (46, 47, 48)
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Specification