ELECTRONIC DEVICE MODULE
First Claim
Patent Images
1. An electronic device module comprising:
- a substrate;
at least one first component and at least one second component disposed on one surface of the substrate;
a shielding wall disposed between the at least one first component and the at least one second component, and disposed on the substrate; and
a sealing portion comprising the at least one first component, the at least one second component and the shielding wall embedded therein, and disposed on the substrate,wherein the shielding wall comprises at least one insulating layer and at least one conductive layer disposed on the at least one insulating layer.
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Abstract
An electronic device module includes a substrate, at least one first component and at least one second component disposed on one surface of the substrate, a shielding wall disposed between the at least one first component and the at least one second component, and disposed on the substrate, and a sealing portion having the at least one first component, the at least one second component and the shielding wall embedded therein, and disposed on the substrate. The shielding wall includes at least one insulating layer and at least one conductive layer disposed on the insulating layer.
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Citations
20 Claims
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1. An electronic device module comprising:
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a substrate; at least one first component and at least one second component disposed on one surface of the substrate; a shielding wall disposed between the at least one first component and the at least one second component, and disposed on the substrate; and a sealing portion comprising the at least one first component, the at least one second component and the shielding wall embedded therein, and disposed on the substrate, wherein the shielding wall comprises at least one insulating layer and at least one conductive layer disposed on the at least one insulating layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. An electronic device module, comprising:
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a first circuit substrate including a ground electrode; at least one first component and at least one second component disposed on one surface of the first circuit substrate; a second circuit substrate disposed between the at least one first component and the at least one second component and disposed on the first circuit substrate to be substantially perpendicular to the first circuit substrate; and a sealing portion having the at least one first component, the at least one second component and the second circuit substrate embedded therein, and disposed on the substrate, wherein a wiring layer on the second circuit substrate is connected to the ground electrode on the first circuit substrate. - View Dependent Claims (16)
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17. An electronic device module, comprising:
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a first substrate comprising a first region and a second region on a surface; a second substrate comprising a ground layer electrically connected to the first substrate, the second substrate disposed on the surface and extending from the surface to divide the surface into the first region and the second region. - View Dependent Claims (18, 19, 20)
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Specification