Method of Manufacturing a Package-on-Package Type Semiconductor Package
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Abstract
A method for manufacturing a semiconductor package, for example a package-on-package type semiconductor device package. As non-limiting examples, various aspects of this disclosure provide high-yield methods for manufacturing a package-on-package type semiconductor package, or a portion thereof.
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Citations
40 Claims
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1-20. -20. (canceled)
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21. A method of manufacturing a semiconductor package, the method comprising:
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providing first package substrates on a carrier, wherein a respective bottom surface of each first package substrate is coupled to a top surface of the carrier; for each first package substrate; attaching a respective semiconductor die to a top surface of the respective first package substrate; and forming, outside of a perimeter of the semiconductor die, a respective stacking terminal on the respective first package substrate; after said attaching a respective semiconductor die and after said forming the respective stacking terminal for each first package substrate, encapsulating the first package substrates, the semiconductor dies, and the stacking terminals in an encapsulating material; thinning the encapsulating material; for each first package substrate, forming a respective second substrate on an uppermost surface of the encapsulating material, wherein said forming the respective second substrate includes forming a conductive trace layer of the respective second substrate over the uppermost surface of the encapsulating material; removing the carrier from the encapsulated first package substrates, semiconductor dies, and stacking terminals; and singulating the encapsulated first package substrates. - View Dependent Claims (22, 23, 24, 25, 26)
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27. A method of manufacturing a semiconductor package, the method comprising:
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providing an array of package substrates on a carrier, wherein; a respective bottom side of each package substrate is attached to a top side of the carrier; a respective top side of each package substrate comprises a die attach region; for each package substrate; attaching a respective semiconductor die to the respective die attach region of said each package substrate; and forming, outside of the respective die attach region of said each package substrate a respective stacking terminal on the respective top side of said each package substrate; forming an encapsulating material that covers at least an upper side of each package substrate of the array of package substrates and at least a lateral side of each of the respective semiconductor dies; and singulating package structures from the encapsulated array of package substrates. - View Dependent Claims (28, 29, 30, 31, 32, 33)
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34. A method of manufacturing a semiconductor package, the method comprising:
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providing an array of package structures on a carrier, the array of package structures comprising; an array of package substrates on the carrier, a respective bottom side of each of the package substrates coupled to a top side of the carrier; on a respective top side of each package substrate of the array of package substrates; a respective semiconductor die coupled to the respective top side; and a respective stacking terminal coupled to the respective top side and outside a lateral perimeter of the respective semiconductor die; and an encapsulating material that encapsulates the array of package substrates, the semiconductor dies, and the stacking terminals; and singulating package structures from the encapsulated array of package substrates. - View Dependent Claims (35, 36, 37, 38, 39, 40)
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Specification