SENSOR CHIP AND ELECTRONIC APPARATUS

• US 20190312077A1
• Filed: 06/21/2019
• Published: 10/10/2019
• Est. Priority Date: 09/05/2017
• Status: Active Grant

• Current Assignee: Sony Semiconductor Solutions Corporation (Sony Group Corp.)
• Original Assignee: Sony Semiconductor Solutions Corporation (Sony Group Corp.)
• Inventors: Yasu, Yohtaro, Hanzawa, Katsuhiko
• Granted Patent: US 10,748,952 B2
• Time in Patent Office: Days
• CPC Class Codes: G01S 7/4863 Detector arrays, e.g. charge-transfer gates
• CPC Class Codes: H01L 27/14634 Assemblies, i.e. Hybrid structures
• CPC Class Codes: H01L 27/14636 Interconnect structures
• CPC Class Codes: H04N 25/53 Control of the integration time
• CPC Class Codes: H04N 25/74 Circuitry for scanning or addressing the pixel array
• CPC Class Codes: H04N 25/745 Circuitry for generating timing or clock signals
• CPC Class Codes: H04N 25/75 Circuitry for providing, modifying or processing image signals from the pixel array
• CPC Class Codes: H04N 25/79 Arrangements of circuitry being divided between different or multiple substrates, chips or circuit boards, e.g. stacked image sensors

Abstract

A time of flight sensor is disclosed. In one example, it includes a pixel array with pixels arranged in rows and columns. A global control circuit disposed along a first side of the pixel array outputs a global control signal to the pixels. The global control circuit has a clock tree structure that includes buffer circuits and driving circuits. A rolling control circuit disposed along a second side of the pixel array outputs a rolling control signal to the pixels. A column circuit with analog-to-digital converters is coupled to the pixels.

Claims