Methods of Manufacturing Semiconductor Devices with a Deep Barrier Layer
First Claim
1. A method of manufacturing a semiconductor device, the method comprising:
- etching a plurality of trenches to a first depth in a semiconductor substrate;
doping a region of the semiconductor substrate surrounding a bottom of the trenches at the first depth to form a doped region in the semiconductor substrate;
after the doped region is formed, etching the plurality of trenches deeper into the semiconductor substrate to a second depth greater than the first depth, adjacent ones of the trenches being separated from one another by a semiconductor mesa; and
forming a body region above the doped region in the semiconductor mesas.
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Abstract
A method of manufacturing a semiconductor device includes: etching a plurality of trenches to a first depth in a semiconductor substrate; doping a region of the semiconductor substrate surrounding a bottom of the trenches at the first depth to form a doped region in the semiconductor substrate; after the doped region is formed, etching the plurality of trenches deeper into the semiconductor substrate to a second depth greater than the first depth, adjacent ones of the trenches being separated from one another by a semiconductor mesa; and forming a body region above the doped region in the semiconductor mesas.
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20 Claims
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1. A method of manufacturing a semiconductor device, the method comprising:
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etching a plurality of trenches to a first depth in a semiconductor substrate; doping a region of the semiconductor substrate surrounding a bottom of the trenches at the first depth to form a doped region in the semiconductor substrate; after the doped region is formed, etching the plurality of trenches deeper into the semiconductor substrate to a second depth greater than the first depth, adjacent ones of the trenches being separated from one another by a semiconductor mesa; and forming a body region above the doped region in the semiconductor mesas. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A semiconductor device, comprising:
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a semiconductor substrate having a first main surface; a plurality of trenches extending from the first main surface into the semiconductor substrate; semiconductor mesas disposed between adjacent ones of the trenches; a hole or electron potential barrier formed in the semiconductor mesas; and a body region formed above the hole or electron potential barrier in the semiconductor mesas, wherein the hole or electron potential barrier has a peak doping concentration of at least 5 E16 cm−
3. - View Dependent Claims (17, 18)
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19. A method of manufacturing a semiconductor device, the method comprising:
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etching a trench to a first depth in a semiconductor substrate; doping a region of the semiconductor substrate surrounding a bottom of the trench at the first depth to form an n-type hole potential barrier; and after the n-type hole potential barrier is formed, etching the trench deeper into the semiconductor substrate to a second depth greater than the first depth. - View Dependent Claims (20)
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Specification