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METHOD OF FABRICATING LIGHT EMITTING DEVICE PACKAGE

  • US 20190312182A1
  • Filed: 06/17/2019
  • Published: 10/10/2019
  • Est. Priority Date: 08/11/2016
  • Status: Active Grant
First Claim
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1. A method of fabricating a light emitting device package comprising in sequence:

  • (1) forming a plurality of semiconductor light emitting parts above a growth substrate, each having a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer vertically stacked on the growth substrate;

    (2) after forming the plurality of semiconductor light emitting parts, and while the plurality of light emitting parts are disposed below the growth substrate, forming a partition structure having a plurality of light emitting windows in the growth substrate, the partition structure including partitions formed of a portion of the growth substrate, and each partition formed between two adjacent semiconductor light emitting parts of the plurality of semiconductor light emitting parts in a plan view; and

    (3) after forming the partition structure and while the plurality of light emitting parts are disposed below the growth substrate;

    filling a resin having a wavelength conversion material into each of the plurality of light emitting windows; and

    forming a plurality of wavelength conversion parts by planarizing a surface of the resin.

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