MULTILAYER WIRING STRUCTURE AND ITS MANUFACTURING METHOD

• US 20190313528A1
• Filed: 04/03/2019
• Published: 10/10/2019
• Est. Priority Date: 04/06/2018
• Status: Active Grant

• Current Assignee: TDK Corporation
• Original Assignee: TDK Corporation
• Inventors: Kuwajima, Hajime, Nishikawa, Tomonaga, Ohtsuka, Takashi, Oohashi, Takeshi, Okuyama, Yuichiro, Yamatani, Manabu
• Granted Patent: US 10,426,032 B1
• Time in Patent Office: Days
• CPC Class Codes: H01L 2224/18 High density interconnect [HDI] connectors; Manufacturing methods related thereto
• CPC Class Codes: H05K 1/09 Use of materials for the conductive, e.g. metallic pattern
• CPC Class Codes: H05K 1/111 Pads for surface mounting, e.g. lay-out
• CPC Class Codes: H05K 1/115 Via connections; Lands around holes or via connections H05K1/112 takes precedence
• CPC Class Codes: H05K 1/162 incorporating printed capacitors
• CPC Class Codes: H05K 2201/0175 Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
• CPC Class Codes: H05K 3/06 the conductive material being removed chemically or electrolytically, e.g. by photo-etch process semi-additive methods H05K3/108
• CPC Class Codes: H05K 3/108 by semi-additive methods; masks therefor characterised by metallic etch mask H05K3/062; electroplating methods or apparatus H05K3/241
• CPC Class Codes: H05K 3/4644 by building the multilayer layer by layer, i.e. build-up multilayer circuits making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602

Abstract

Disclosed herein is a multilayer wiring structure that includes a first metal layer; an interlayer insulating film formed on the first metal layer, the interlayer insulating film having an opening that exposes a first area of the first metal layer; a second metal layer formed on an inner wall of the opening; and a third metal layer filling the opening via the second metal layer. The first and third metal layers are direct contact with each other at a bottom of the opening.

Claims

1. A multilayer wiring structure comprising:

a first conductive pattern provided in a first wiring layer, the first conductive pattern including a first main conductive layer;

an interlayer insulating film covering the first wiring layer, the interlayer insulating film having an opening for exposing a part of the first conductive pattern; and

a second conductive pattern provided in a second wiring layer and connected to the first conductive pattern through the opening,

wherein the second conductive pattern includes a seed layer contacting the interlayer insulating film and a second main conductive layer provided on the seed layer, the second main conductive layer being formed of the same metal material as the first main conductive layer, and

wherein the seed layer is removed at least at a part of a bottom portion of the opening, thereby the first and second main conductive layers are brought into contact with each other at least at the part of the bottom portion of the opening without the seed layer being interposed therebetween.

2. The multilayer wiring structure as claimed in claim 1,

wherein an inner wall surface and bottom outer peripheral edge of the opening are covered with the seed layer, and

wherein the first and second main conductive layers are brought into contact with each other at a center portion surrounded by the outer peripheral edge without the seed layer being interposed therebetween.

3. The multilayer wiring structure as claimed in claim 1, wherein the first and second main conductive layers are formed of copper (Cu).

4. The multilayer wiring structure as claimed in claim 3, wherein the seed layer is formed of chromium (Cr), nickel (Ni), titanium (Ti), tungsten (W), tantalum (Ta), or an alloy or laminate including any of the elements.

5. The multilayer wiring structure as claimed in claim 3, wherein a crystal of copper (Cu) constituting the first and second main conductive layers exists while crossing a boundary defining the bottom portion of the opening at a portion where the first and second main conductive layers are in contact with each other.

6. A method of manufacturing a multilayer wiring structure, the method comprising:

forming a first conductive pattern including a first main conductive layer;

forming an interlayer insulating film covering the first conductive pattern;

forming an opening in the interlayer insulating film for exposing a part of the first main conductive layer;

forming a seed layer on the interlayer insulating film and inside the opening;

exposing the first main conductive layer by removing at least partially the seed layer formed on a bottom portion of the opening; and

forming a second main conductive layer formed of the same metal material as the first main conductive layer on the seed layer and the first main conductive layer exposed from the opening.

7. The method of manufacturing a multilayer wiring structure as claim in claim 6, wherein, in the exposing, the seed layer formed at the bottom portion of the opening is partially removed so that a contact portion between the first main conductive layer and the seed layer remains.

8. The method of manufacturing a multilayer wiring structure as claim in claim 7, wherein an electrolytic plating is performed by power feeding through the seed layer in the forming the second main conductive layer.

9. The method of manufacturing a multilayer wiring structure as claim in claim 8, wherein the seed layer includes a lower seed layer formed of chromium (Cr), nickel (Ni), titanium (Ti), tungsten (W), tantalum (Ta), or an alloy or laminate including any of the elements and an upper seed layer formed of copper (Cu).

10. An apparatus comprising:

a first metal layer;

an interlayer insulating film formed on the first metal layer, the interlayer insulating film having an opening that exposes a first area of the first metal layer;

a second metal layer formed on an inner wall of the opening; and

a third metal layer filling the opening via the second metal layer,

wherein the first and third metal layers are direct contact with each other at a bottom of the opening.

11. The apparatus as claimed in claim 10, wherein the second metal layer is made of a different material from the first and third metal layers.

12. The apparatus as claimed in claim 11, wherein the first metal layer is made of the same material as the third metal layer.

13. The apparatus as claimed in claim 12, wherein the second metal layer has higher in resistivity than the first and third metal layers.

14. The apparatus as claimed in claim 13, wherein the second metal layer has higher in resistivity than the first and third metal layers.

15. The apparatus as claimed in claim 10, wherein the second metal layer is further formed on a part of the first area of the first metal layer.