ELECTRONIC COMPONENT DEVICE, HIGH-FREQUENCY FRONT END CIRCUIT, AND COMMUNICATION DEVICE
First Claim
1. An electronic component device comprising:
- an electronic component;
a resin structure including the electronic component such that one main surface of the electronic component is exposed therefrom; and
a wiring layer provided on at least a portion of a surface of each of the resin structure and the electronic component;
whereinthe electronic component includes;
an element body;
an inner electrode provided in the element body and connected to the wiring layer; and
an adjustment electrode provided at least in an adjustment region between the inner electrode and a side surface of the resin structure closest to the inner electrode in the element body;
the wiring layer is continuously provided on the inner electrode, the adjustment region, and the resin structure; and
a thermal expansion coefficient of the resin structure, a thermal expansion coefficient of the adjustment region, and a thermal expansion coefficient of the inner electrode satisfy an expression of the thermal expansion coefficient of the resin structure≤
the thermal expansion coefficient of the adjustment region≤
the thermal expansion coefficient of the inner electrode.
1 Assignment
0 Petitions
Accused Products
Abstract
An electronic component device includes an electronic component, a resin structure including the electronic component such that one main surface thereof is exposed, a through-electrode, and first and second wiring layers, in which the electronic component includes an element body, an inner electrode in the element body and connected to the first and second wiring layers, and an adjustment electrode provided in an adjustment region in the element body, the first wiring layer is continuously provided on the inner electrode, the adjustment region, and the resin structure, and a thermal expansion coefficient of the resin structure, a thermal expansion coefficient of the adjustment region, and a thermal expansion coefficient of the inner electrode satisfy an expression of the thermal expansion coefficient of the resin structure≤the thermal expansion coefficient of the adjustment region≤the thermal expansion coefficient of the inner electrode.
-
Citations
20 Claims
-
1. An electronic component device comprising:
-
an electronic component; a resin structure including the electronic component such that one main surface of the electronic component is exposed therefrom; and a wiring layer provided on at least a portion of a surface of each of the resin structure and the electronic component;
whereinthe electronic component includes; an element body; an inner electrode provided in the element body and connected to the wiring layer; and an adjustment electrode provided at least in an adjustment region between the inner electrode and a side surface of the resin structure closest to the inner electrode in the element body; the wiring layer is continuously provided on the inner electrode, the adjustment region, and the resin structure; and a thermal expansion coefficient of the resin structure, a thermal expansion coefficient of the adjustment region, and a thermal expansion coefficient of the inner electrode satisfy an expression of the thermal expansion coefficient of the resin structure≤
the thermal expansion coefficient of the adjustment region≤
the thermal expansion coefficient of the inner electrode. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
-
Specification