CIRCUIT MODULE AND METHOD OF MANUFACTURING THE SAME

• US 20190318974A1
• Filed: 06/25/2019
• Published: 10/17/2019
• Est. Priority Date: 12/27/2016
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: FUJIKAWA, Katsuhiko, FUNAKAWA, Shingo, SATO, Kazushige, AMACHI, Nobumitsu
• Granted Patent: US 10,741,465 B2
• Time in Patent Office: Days
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 23/29 characterised by the material , e.g. carbon interlayer dielectrics H01L23/5329
• CPC Class Codes: H01L 23/31 characterised by the arrangement or shape
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 23/36 Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks H01L23/28, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence; heating H01L23/345
• CPC Class Codes: H01L 23/3677 Wire-like or pin-like cooling fins or heat sinks
• CPC Class Codes: H01L 23/3736 Metallic materials H01L23/3732, H01L23/3733, H01L23/3735, H01L23/3737, H01L23/3738 take precedence
• CPC Class Codes: H01L 23/4334 Auxiliary members in encapsulations H01L23/49568 takes precedence
• CPC Class Codes: H01L 23/495 Lead-frames or other flat leads H01L23/498 takes precedence; lead frame interconnections between components H01L23/52
• CPC Class Codes: H01L 23/49503 characterised by the die pad
• CPC Class Codes: H01L 23/49568 specifically adapted to facilitate heat dissipation
• CPC Class Codes: H01L 23/49575 Assemblies of semiconductor devices on lead frames
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 25/0652 the devices being arranged next and on each other, i.e. mixed assemblies
• CPC Class Codes: H01L 25/16 the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
• CPC Class Codes: H01L 25/18 the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H05K 2201/10378 Interposers
• CPC Class Codes: H05K 2201/10621 Components characterised by their electrical contacts
• CPC Class Codes: H05K 2201/2018 Presence of a frame in a printed circuit or printed circuit assembly
• CPC Class Codes: H05K 3/36 : Assembling printed circuits with other printed circuits H05K7/142 takes precedence

Abstract

A circuit module (301) includes a first substrate (201), a first module (101), a sealing resin portion (3), and a conductive material film (7). The first substrate (201) has a first principal surface (201a). The first module (101) is mounted on the first principal surface (201a). The sealing resin portion (3) is formed on the first principal surface (201a) and covers the first module (101). The conductive material film (7) covers a side of the sealing resin portion (3). The first module (101) includes a conductive material portion and a device which may produce heat and which is mounted on the conductive material portion. The conductive material portion connects with the conductive material film (7) on the side of the sealing resin portion (3).

Claims

1. A circuit module comprising:

a first substrate having a first principal surface;

a first module mounted on the first principal surface;

a sealing resin portion provided on the first principal surface and covering the first module; and

a conductive material film covering a side of the sealing resin portion,

wherein the first module includes a conductive material portion, and a device capable of producing heat and mounted on the conductive material portion, and

wherein the conductive material portion is connected to the conductive material film on the side of the sealing resin portion.

2. The circuit module according to claim 1,

wherein the first module has an insulated substrate, and

wherein the conductive material portion includes a conductor pattern disposed on a surface of the insulated substrate.

3. The circuit module according to claim 1,

wherein the conductive material portion includes a lead frame.

4. The circuit module according to claim 3,

wherein the conductive material portion includes a bent portion extending along the side of the sealing resin portion, and

wherein the bent portion is connected to the conductive material film.

5. A method for manufacturing a circuit module, comprising:

a step of preparing a first substrate including a first principal surface;

a step of preparing a first module, the first module including a conductive material portion, and a device capable of producing heat and mounted on the conductive material portion;

a step of mounting the first module on the first principal surface;

a step of forming a sealing resin portion on the first principal surface in such a manner that the sealing resin portion covers the first module;

a step of exposing a cross section of the conductive material portion on a side of the sealing resin portion while a portion of the sealing resin portion is removed; and

a step of forming a conductive material film in such a manner that the conductive material film covers the side of the sealing resin portion, and thus obtaining a structure having the exposed cross section of the conductive material portion connected to the conductive material film on the side of the sealing resin portion.

6. The method for manufacturing a circuit module, according to claim 5,

wherein the first module has an insulated substrate, and

wherein the conductive material portion includes a conductor pattern disposed on a surface of the insulated substrate.

7. The method for manufacturing a circuit module, according to claim 5,

wherein the conductive material portion includes a lead frame.