SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING THE SAME
First Claim
1. A method for manufacturing a semiconductor device, comprising:
- providing a semiconductor substrate, wherein the semiconductor substrate has a first region and a second region adjacent to the first region;
forming an interconnection structure on the first region of the semiconductor substrate and a fuse structure on the second region of the semiconductor substrate;
forming a first conductive pad on the interconnection structure, wherein the first conductive pad is electrically connected to the interconnection structure;
forming a capping layer to cover the first conductive pad and the fuse structure;
forming an etching stop layer to cover the capping layer;
forming a first dielectric layer to cover the etching stop layer; and
performing a first etching process to remove the first dielectric layer, the etching stop layer and the capping layer so that a first opening is formed in the first region to expose the first conductive pad and a second opening is formed above the fuse structure, wherein during the first etching process, the first dielectric layer has a first etching rate, and the etching stop layer has a second etching rate that is lower than the first etching rate.
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Abstract
A method for manufacturing a semiconductor device is provided. The method includes providing a substrate having a first region and a second region. The method also includes forming an interconnection structure on the first region and a fuse structure on the second region. The method further includes forming a first conductive pad on the interconnection structure. In addition, the method includes forming a capping layer, an etching stop layer and a dielectric layer to cover the first conductive pad and the fuse structure. The method further includes performing an etching process so that a first opening is formed to expose the conductive pad and a second opening is formed directly above the fuse structure. During the etching process, the first dielectric layer has a first etching rate, and the etching stop layer has a second etching rate that is lower than the first etching rate.
2 Citations
20 Claims
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1. A method for manufacturing a semiconductor device, comprising:
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providing a semiconductor substrate, wherein the semiconductor substrate has a first region and a second region adjacent to the first region; forming an interconnection structure on the first region of the semiconductor substrate and a fuse structure on the second region of the semiconductor substrate; forming a first conductive pad on the interconnection structure, wherein the first conductive pad is electrically connected to the interconnection structure; forming a capping layer to cover the first conductive pad and the fuse structure; forming an etching stop layer to cover the capping layer; forming a first dielectric layer to cover the etching stop layer; and performing a first etching process to remove the first dielectric layer, the etching stop layer and the capping layer so that a first opening is formed in the first region to expose the first conductive pad and a second opening is formed above the fuse structure, wherein during the first etching process, the first dielectric layer has a first etching rate, and the etching stop layer has a second etching rate that is lower than the first etching rate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A semiconductor device, comprising:
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a semiconductor substrate, wherein the semiconductor substrate has a first region and a second region adjacent to the first region; an interconnection structure and a fuse structure disposed on the first region and the second region of the semiconductor substrate, respectively; a first dielectric layer covering the interconnection structure and the fuse structure; a first conductive pad disposed on the interconnection structure, wherein the first conductive pad is electrically connected to the interconnection structure; a capping layer disposed on the first region and the second region of the semiconductor substrate, wherein the capping layer covers a sidewall of the first conductive pad; an etching stop layer disposed on the second region of the semiconductor substrate, wherein the etching stop layer covers the capping layer; a second dielectric layer disposed on the etching stop layer and the capping layer; and a first opening disposed on the fuse structure and the second region of the semiconductor substrate, wherein the first opening removes the second dielectric layer, the etching stop layer, the capping layer and a portion of the first dielectric layer. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20)
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Specification