ANISOTROPIC CONDUCTIVE FILM

• US 20190319003A1
• Filed: 10/18/2017
• Published: 10/17/2019
• Est. Priority Date: 10/24/2016
• Status: Active Grant

• Current Assignee: Dexerials Corporation
• Original Assignee: Dexerials Corporation
• Inventors: MIYAKE, Takeshi, TSUKAO, Reiji, FUKAYA, Tatsurou
• Granted Patent: US 11,557,562 B2
• Time in Patent Office: Days
• CPC Class Codes: C09J 2203/326 for bonding electronic components such as wafers, chips or semiconductors
• CPC Class Codes: C09J 2461/00 Presence of condensation polymers of aldehydes or ketones
• CPC Class Codes: C09J 2463/00 Presence of epoxy resin
• CPC Class Codes: C09J 5/00 Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
• CPC Class Codes: C09J 7/30 characterised by the adhesive composition
• CPC Class Codes: C09J 9/02 Electrically-conducting adhesives
• CPC Class Codes: H01L 2224/271 Manufacture and pre-treatment of the layer connector preform
• CPC Class Codes: H01L 2224/292 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/29286 with a principal constituent of the material being a non metallic, non metalloid inorganic material
• CPC Class Codes: H01L 2224/2929 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/29386 with a principal constituent of the material being a non metallic, non metalloid inorganic material
• CPC Class Codes: H01L 2224/29499 Shape or distribution of the fillers
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/743 Apparatus for manufacturing layer connectors
• CPC Class Codes: H01L 2224/83851 being an anisotropic conductive adhesive
• CPC Class Codes: H01L 24/27 Manufacturing methods
• CPC Class Codes: H01L 24/29 of an individual layer connector
• CPC Class Codes: H01L 24/83 using a layer connector
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/05432 Al2O3
• CPC Class Codes: H01L 2924/05442 : SiO2
• CPC Class Codes: H01L 2924/061 : Polyolefin polymer
• CPC Class Codes: H01L 2924/0665 : Epoxy resin
• CPC Class Codes: H01L 2924/0675 : Polyester
• CPC Class Codes: H01L 2924/0685 : Polyether
• CPC Class Codes: H01L 2924/069 : Polyurethane
• CPC Class Codes: H01L 2924/0695 : Polyamide
• CPC Class Codes: H01L 2924/07025 : Polyimide

Abstract

An anisotropic conductive film can reduce the conduction resistance of an anisotropic conductively connected connection structure, and can reliably suppress the occurrence of short-circuits. The film has a structure wherein insulating particle-including conductive particles, wherein insulating particles adhere to the surfaces of conductive particles, are distributed throughout an insulating resin layer. In the insulating particle-including conductive particles, a number of insulating particles in contact with the conductive particles with respect to a film thickness direction is lower than with respect to a film planar direction. Preferably, a number of the insulating particles overlapping with the conductive particles when one of a front and rear film surface of the anisotropic conductive film is viewed in plan view is lower than a number of the insulating particles overlapping with the conductive particles when the other of the film surfaces is viewed in plan view.

Claims

1. An anisotropic conductive film comprising insulating particle-including conductive particles, in which insulating particles adhere to the surfaces of conductive particles, the insulating particle-including conductive particles being distributed throughout an insulating resin layer,

wherein in the insulating particle-including conductive particles, a number of the insulating particles in contact with the conductive particles with respect to a film thickness direction is lower than a number of the insulating particles in contact with the conductive particles with respect to a film planar direction.

2. The anisotropic conductive film according to claim 1,

wherein a number of the insulating particles overlapping with the conductive particles when one of a front and rear film surface of the anisotropic conductive film is viewed in plan view is lower than a number of the insulating particles overlapping with the conductive particles when the other of the film surfaces is viewed in plan view.

3. The anisotropic conductive film according to claim 1,

wherein the insulating particle-including conductive particles are disposed without being in contact with each other.

4. The anisotropic conductive film according to claim 1,

wherein a low-viscosity insulating resin layer having a lower minimum melt viscosity than the insulating resin layer is laminated onto the insulating resin layer.

5. The anisotropic conductive film according to claim 4,

wherein the insulating particle-including conductive particles are present between the insulating resin layer and the low-viscosity insulating resin layer.

6. The anisotropic conductive film according to claim 5,

wherein a number of insulating particles on the conductive particles when a low-viscosity insulating resin layer-side film surface is viewed in plan view is lower than a number of insulating particles on the conductive particles when an insulating resin layer-side film surface is viewed in plan view.

7. The anisotropic conductive film according to claim 1,

wherein when a distance from the one of front and rear surfaces of the insulating resin layer that is closer to the insulating particle-including conductive particles, to a deepest part of the insulating particle-including conductive particles, is represented by Lb, and a particle diameter of the insulating particle-including conductive particles is represented by D, a ratio between the distance Lb and the particle diameter D (Lb/D) is from 30 to 105%.

8. The anisotropic conductive film according to claim 1,

wherein a surface of the insulating resin layer near the insulating particle-including conductive particles includes inclinations or undulations relative to a tangent plane of the insulating resin layer, to a central portion of the insulating resin layer between adjacent ones of the insulating particle-including conductive particles.

9. The anisotropic conductive film according to claim 8,

wherein at the inclinations, the surface of the insulating resin layer near the insulating particle-including conductive particle is absent with respect to the tangent plane, and at the undulations, an amount of resin in the insulating resin layer directly above the insulating particle-including conductive particles is lower than when the surface of the insulating resin layer directly above the insulating particle-including conductive particles corresponds to the tangent plane.

10. A method for manufacturing a connection structure, the method comprising making an anisotropic conductive connection between electronic components using the anisotropic conductive film according to claim 1.

11. A connection structure in which an anisotropic conductive connection is made between electronic components using the anisotropic conductive film according to claim 1.

12. A connection structure in which terminals of opposing electronic components are anisotropic conductively connected by insulating particle-including conductive particles and an insulating resin layer,

wherein the insulating particle-including conductive particles not held between the opposing terminals include insulating particle-including conductive particles having an insulating particle-lacking area facing in the direction in which the terminals oppose each other.